TET
TOKYO ELETECH CORPORATION
TOKYO ELETECH CORPORATION
TOKYO ELETECH CORPORATION
TOKYO ELETECH CORPORATION
2
2.3
The kit includes:
・
SICA10I2P cable
One piece
・
Mating socket at a target board(SICA2P20S)
One piece
・
Notes for handling SICA
One piece
2.4
Recommend soldering temperature profile on the surface of the mating socket
at target side, SICA2P20S.
1.
Please visit the following web site to get the target board footprint pattern.
http://www.tetc.co.jp/pdf/sica_zumen/sica2p20s.pdf
2.
The thickness and opening of metal mask stencils
for
SICA2P20S
Thickness : 150
μ
Opening of metal mask stencils : 60%
3.
Soldering temperatures :
a . Lead free soldering
(Sn-3Ag-0.5Cu)
Solder reflow equipment :
Preheating temperature : 220
℃
for 40 seconds max.
Maximum temperature : 260
℃
Hand soldering :
Maximum temperature : 380
℃
for 3 seconds or less.
b. Tin-lead soldering
Solder reflow equipment :
Preheating temperature : 200
℃
for 30 seconds max.
Reflow temperature : 245
℃
Hand soldering :
Maximum temperature : 350
℃
for 3 seconds or less.
