SL869T3-I Product User Guide
1VV0301546 Rev. 3
Page 53 of 68
2021-03-31
13.4.
ESD Sensitivity
The module contains class 1 devices and is classified as Electro-Static Discharge
Sensitive (ESDS).
Telit recommends the two basic principles of protecting ESD devices from damage:
•
Handle sensitive components only in an ESD Protected Area (EPA) under protected
and controlled conditions;
•
Protect sensitive devices outside the EPA using ESD protective packaging.
All personnel handling ESDS devices have the responsibility to be aware of the ESD threat
to the reliability of electronic products.
Further information can be obtained from the JEDEC standard JESD625-A Requirements
for Handling Electrostatic Discharge Sensitive (ESDS) Devices.
13.5.
Reflow
The modules are compatible with lead free soldering processes as defined in IPC/JEDEC
J-STD-020E. The reflow profile must not exceed the profile given IPC/JEDEC J-STD-020E
Table 5-
1, “Classification Reflow Profiles”. Although IPC/JEDEC J
-STD-020E allows for
three reflows, the assembly process for the module uses one of those profiles, therefore
the module is limited to two reflows.
When re-flowing a dual-sided SMT board, it is important to reflow the side containing the
module last. This prevents heavier components within the module from becoming
dislodged if the solder reaches liquidus temperature while the module is inverted.
Note/Tip: JEDEC standards are available free from the JEDEC
website
13.6.
Assembly Considerations
During board assembly and singulation process steps, pay careful attention to unwanted
vibrations, resonances and mechanical shocks introduced by the board router.
13.7.
Washing Considerations
The module can be washed using standard PCB cleaning procedures after assembly. The
shield does not provide a water seal to the internal components of the module, so it is
important that the module be thoroughly dried prior to use by blowing excess water and
then baking the module to drive residual moisture out. Depending upon the board
