SE873 Family Product User Guide
Product Packaging and Handling
1VV0301216
Rev.4
Page 57 of 69
2018-08-24
ESD Sensitivity
The SE873 module contains class 1 devices and is classified as Electro-Static Discharge
Sensitive (ESDS).
Telit recommends the two basic principles of protecting ESD devices from damage:
•
Handle sensitive components only in an ESD Protected Area (EPA) under protected and
controlled conditions;
•
Protect sensitive devices outside the EPA using ESD protective packaging.
All personnel handling ESDS devices have the responsibility to be aware of the ESD threat to the
reliability of electronic products.
Further information can be obtained from the JEDEC standard
JESD625-A Requirements for
Handling Electrostatic Discharge Sensitive (ESDS) Devices
.
Reflow
The modules are compatible with lead free soldering processes as defined in
IPC/JEDEC J-STD-
020
. The reflow profile must not exceed the profile given
IPC/JEDEC J-STD-020
Table 5-2,
“Classification Reflow Profiles”. Although
IPC/JEDEC J-STD-020
allows for three reflows, the
assembly process for the module uses one of those profiles, therefore the module is limited to
two reflows.
When re-flowing a dual-sided SMT board, it is important to reflow the side containing the module
last. This prevents heavier components within the module from becoming dislodged if the solder
reaches liquidus temperature while the module is inverted.
Note
: JEDEC standards are available for free from the JEDEC website
.
Assembly Considerations
During board assembly and singulation process steps, pay careful attention to unwanted
vibrations, resonances and mechanical shocks introduced by the board router.
Washing Considerations
The module can be washed using standard PCB cleaning procedures after assembly. The shield
does not provide a water seal to the internal components of the module, so it is important that the
module be thoroughly dried prior to use by blowing excess water and then baking the module to
drive residual moisture out. Depending upon the board cleaning equipment, the drying cycle may
not be sufficient to thoroughly dry the module, so additional steps may need to be taken. Exact
process details will need to be determined by the type of washing equipment as well as other
components on the board to which the module is attached. The module itself can withstand
standard JEDEC baking procedures.
Safety
Improper handling and use of this module can cause permanent damage to it. There is also the
possible risk of personal injury from mechanical trauma or choking hazard.
See section
or safety information.
Disposal
We recommend that this product should not be treated as household waste. For more detailed
information about recycling this product, please contact your local waste management authority
or the reseller from whom you purchased the product.
Summary of Contents for SE873 Series
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