Telit Wireless Solutions BlueMod+S42/AI, Hardware User'S Manual

Page: 50 / 62

S42 Hardware User Guide
1VV0301303 Rev.3 – 2016-08-22
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 50 of 62
Preheat Main Heat Peak
tsmax tLmax tpmax
Temperature Time Temperature Time Temperature Time
[°C] [sec] [°C] [sec] [°C] [sec]
150
100
217 90 260
10
230 50
Average ramp-up rate [°C / sec] 3
Average ramp-down rate [°C / sec] 6
Max. Time 25°C to Peak
Temperature [min.] 8
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to 1 re-flows to a maximum
temperature of 260°C. The reflow soldering profile may only be applied if the
S42resides on the PCB side looking up. Heat above the solder eutectic point while
the S42is mounted facing down may damage the module permanently.
6.4 Placement Recommendation
To achieve best radio performance for S42/AI, it is recommended to use the
placement shown in
Figure 19. This is a “corner placement”
meaning the S42/AI is placed such that the antenna comes close to the corner of
the application PCB (red area). So, the yellow area is outside the PCB and regards to the
housing, too (refer to 6.5).
Please note that for best possible performance the antenna should be directed away from the
application PCB as shown in
Figure 19.
max.0,5
4,5
10
10
m
ax
.0,
5
10
15
no bare copper (exept solder pads for module)
no copper and components on any layer
no components on any layer
provide solid ground plane(s) as large as possible around
17
do not place any conductive parts in this area
20
20
40
area
Applic. PCB