Telink FR1 PCB Design Guideline
AN-22051900-E1 Ver. 1.0.0
6
1.
Overview
With the same PCB size and the same quantity of components, generally the fewer the number of PCB
layers, the more difficult the design.
Due to cost concern, PCB designs are increasingly preferred to use FR1 boards, single-layer boards, which
leads to more obvious problems in wireless communication, including power interference, RF high harmonics,
and etc.
This document uses the Telink SoC chips as a basis and the remote control design as an example to illustrate
how to guide the design of FR1 boards to achieve fast development and avoid multiple iterations.
