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TM 11-6625-3145-14
Section 6-318/338 Service
MAINTENANCE: GENERAL INFORMATION
Tektronix maintains repair and recalibration facilities at its local Field Service Centers and the Factory Service Center. For
further information or assistance, contact your local Tektronix Field Office or representative.
TROUBLESHOOTING TREES
The troubleshooting trees are divided into two sets; one for the 318, and one for the 338. The trees for the 318 are located
after the diagnostic test descriptions for the 318, in roughly the center of Section 7. The Diagnostic trees for the 338 are
located after the diagnostic test descriptions for that logic analyzer, starting near the end of Section 7. Refer to the page-
edge tabs for help in locating the information you need.
The troubleshooting trees are intended to be used as a guide in identifying problem areas and isolating component
malfunctions. To use the trees, start at the beginning block and answer each logical-block question until the fault is
isolated. If there are further problems after the first fault is corrected, you must start over at the beginning block. Some
malfunctions, especially those involving multiple simultaneous failures, may require more elaborate approaches with
frequent reference to the circuit descriptions in Section 4.
TEST EQUIPMENT REQUIRED FOR MAINTENANCE
TOOLS REQUIRED FOR MAINTENANCE
The following tools are those most often needed when servicing the instrument:
bristle brush
1/2 inch wrench
5 mm metric wrench
1/16 inch Allen wrench
Phillips head screwdriver
15 W soldering iron
desoldering tool
isopropyl alcohol
lint-free swabs
MAINTENANCE PRECAUTIONS
SOLDERING
Most of the components in the instrument are soldered in place. If it is necessary to replace a soldered part, use a 15 W
soldering iron to prevent heat damage to the circuit board or components. Excessive heat will lift circuit runs on the circuit
board.
The flux in the solder may leave a residue on the circuit board which can provide a high resistance leakage path and affect
instrument operation. Be sure to clean off this residue. Isopropyl alcohol may be used.
6-1
Summary of Contents for 318
Page 119: ...318 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 182: ...338 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 253: ...318 ___________________ TROUBLESHOOTING TREES ...
Page 344: ...338 TROUBLESHOOTING TREES ...
Page 517: ...TM 11 6625 3145 14 318 338 4434 923 318 Block Diagram ...
Page 518: ...TM 11 6625 3145 14 318 338 4434 924 338 Block Diagram ...
Page 519: ...TM 11 6625 3145 14 318 338 4434 925 318 Acquisition Module Wiring Diagram ...
Page 520: ...TM 11 6625 3145 14 318 338 4434 926 318 338 Mainframe Wiring Diagram ...
Page 521: ...TM 11 6625 3145 14 318 338 4434 926 338 Acquisition Module Wiring Diagram ...
Page 522: ...TM 11 6625 3145 14 318 338 4434 928 Figure 9 1 318 A01 Input A Board Component Locations ...
Page 526: ...TM 11 6625 3145 14 ...
Page 528: ...TM 11 6625 3145 14 Figure 9 3 318 338 A03 ACQ Control Board Component Locations ...
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Page 542: ...TM 11 6625 3145 14 Figure 9 8 318 338 A10 CRT Board Component Locations ...
Page 544: ...TM 11 6625 3145 14 Figure 9 9 318 338 A11 Inverter Board component Locations ...
Page 546: ...TM 11 6625 3145 14 Figure 9 10 318 338 A12 Regulator Board Component Locations ...
Page 551: ...TM 11 6625 3145 14 Figure 9 12 338 A01 Input A Board Component Locations ...
Page 553: ...TM 11 6625 3145 14 318 338 SERVICE ...
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Page 555: ...PIN 058584 ...