TASKING iSYSTEM Infineon TC377TE, User Manual, Page: 11 / 20

Assembly
BGA
Watch out that the pin 1 position and alignment of all pins match when connecting two
parts together.
To prevent breaking of the hardware setup or just part of it, avoid disassembling and
reassembling the hardware setup too frequently.
1. Solder the Solder part [ B ] on the embedded target PCB [ A ] to get a BA setup .
Use the Surface Mount Technology (SMT) to solder the Solder parts to the user target
board instead of the original microcontroller. iSYSTEM provides this soldering service
on request too.
2. If an optional Extender [ C ] is used, connect it to the Solder part [ B ] of the BA setup . You get a
CBA setup .
The Extender [C] can also provide protection from damaging the Solder part [B] if the Emulation Adapter setup is supposed to be
assembled and disassembled during the usage. In such case, it is recommended that the Emulation Adapter (D) is
disconnected from the Extender [C] and not from the Solder part [B].
Be careful and gentle during this procedure because all parts of the setup are extremely sensitive, and pins can easily bend or
even break in the worst-case scenario.
More Extenders [C] can be stacked to gain height between the Emulation Adapter [D] and the Target [A]. This is useful if
surrounding components around the Solder part [B] are so high that they prevent connecting the Emulation Adapter [D]. Keep the
number of Extenders [C] at minimum since every Extender degrades the signal integrity of the electrical signals.
3. Assemble the Emulation Adapter [ D ] with the (C)BA setup by connecting the Emulation
Adapter [ D ] to:
· the Solder part of the BA setup , or
· the Extender of the CBA setup when it's being used.
BGA Adaptation Setup