Tandem t:slim X2, User Manual

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Chapter 20 – Technical Specifications
20.7 Electromagnetic Immunity
The t:slim X2 Pump is intended for use in the electromagnetic environment specified below. Always make sure that the pump is
used in such an environment.
Guidance and Manufacturer’s Declaration – Electromagnetic Immunity
Immunity Test IEC 60601 Test Level Compliance Level
Electromagnetic Environment –
Guidance
Electrostatic Discharge (ESD)
IEC 61000-4-2
± 8 kV contact
± 15 kV air ± 8 kV contact
± 15 kV air Floors should be wood, concrete or ceramic tile. If floors
are covered with synthetic material, the relative humidity
should be at least 30%.
Electrical Fast Transient/burst
IEC 61000-4-4
± 2 kV for power supply lines
± 1 kV for input/ output lines ± 2 kV for power supply lines
± 1 kV for input/output lines Mains power quality should be that of a typical commercial
or hospital environment.
Surge
IEC 61000-4-5
± 1 kV differential mode
± 2 kV common mode ± 1 kV differential mode
± 2 kV common mode Mains power quality should be that of a typical commercial
or hospital environment.
Voltage Dips, Short Interruptions,
and Voltage Variations on Power
Supply Input Lines IEC 61000-4-11
<5% Ur (>95% dip in Ur) for 0,5 cycle
40% Ur (60% dip in Ur) for 5 cycles
70% Ur (30% dip in Ur) for 25 cycles
<5% Ur (>95% dip in Ur) for 5 sec <5% Ur (>95% dip in Ur) for 0,5 cycle
40% Ur (60% dip in Ur) for 5 cycles
70% Ur (30% dip in Ur) for 25 cycles
<5% Ur (>95% dip in Ur) for 5 sec Mains power quality should be that of a typical commercial
or hospital environment. If the user of the pump requires
continued operation during power mains interruptions,
it is recommended that the pump be powered from an
uninterruptible power supply or a battery.
NOTE: Ur is the a.c. mains voltage prior to application of
the test level.
Power Frequency (50/60 Hz)
Magnetic Field IEC 61000-4-8
3 A/m 400 A/m (IEC 60601-2-24) Power frequency magnetic fields should be at levels
characteristic of a typical location in a typical commercial
or hospital environment.
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