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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Generation Intel® Xeon® Scalable processors in LGA4189 socket; Supports CPU TDP up to 270W.
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621A
BIOS
AMI 256Mb SPI Flash EEPROM
Memory
32 DIMM slots for up to 8TB 3DS ECC DDR4-3200:LRDIMM/RDIMM or 8TB Intel® Optane™ DDR4-3200:DCPMM
Storage Drives
Eight 2.5" hot-swap NVMe/SATA/SAS hybrid drive bays
Four optional front 2.5” hot-swap NVMe/SATA/SAS hybrid drive bays
Two M.2 NVMe or Two M.2 SATA3
PCI Expansion Slots
Two PCIe 4.0 x16 FH, 10.5"L
One PCIe 4.0 x16 FHHL
Input/Output
Network: One AIOM (Slim) slot for flexible networking (OCP 3.0 compatible)
LAN: One RJ45 Dedicated BMC LAN port
USB: Three USB 3.0 ports (2 Rear, 1 Front)
Video : One VGA port (1 Rear)
Motherboard
X12DHM-6; Length 17.0", Width 10.7" (431.8 mm x 271.8 mm)
Chassis
CSE-HS119-R1K24P 1U Rackmount, 1.7 x 17.2 x 29.3in. / 43 x 437 x 746mm (HxWxD)
System Cooling
Eight 4cm heavy duty fans with optimal fan speed control
Two air shrouds
Power Supply
Model: (default) PWS-1K24A-1R 1200W redundant modules, 80Plus Titanium level;
AC Input
800W: 100-127Vac/50-60 Hz
1200W: 200-240Vac/50-60 Hz
+12V
Max: 83A (100Vac-127Vac)
Max: 166A (200Vac-240Vac)
12V SB
Max: 2.1A / Min: 0A
