Appendix B: System Specifications
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Appendix B
System Specifications
Processors (per node)
Single AMD EPYC™ 7003/7002 Series processors in Socket SP3 type sockets
Note: Please refer to the product page on our website for updates to supported processors.
Chipset
System on Chip
BIOS
32MB SPI AMI BIOS® SM Flash UEFI BIOS
Memory
Each node supports up to 2TB Registered ECC DDR4 3200MHz SDRAM
Note: See the memory section in Chapter 3 for details and our website for updates to supported memory.
SATA Controller
On-chip (System on Chip) controller
Drive Bays (per node)
Two SATA/NVMe + six SATA 3.5" or 2.5" drives per node
PCI Expansion Slots
(per node)
1x PCIe 4.0 x16 slot
1x PCIe 4.0 x8
1x AIOM networking slot (PCIe 4.0 x16)
M.2 Interface: 4x PCIe 4.0 x4
Motherboard
(per node)
One H12SSFR-AN6 motherboard, proprietary form factor (18.73" (L) x 8.54" (W) (475.74 mm x 216.92 mm))
Chassis
CSE-F424AS3-R2K20BP; 4U Rackmount,(WxHxD) 17.63 x 6.96 x 29 in. (448 x 177 x 737 mm)
System Cooling (per node)
Two 8-cm PWM fans
Power Supplies (four per system)
Model: PWS-2K20A-1R, 4x Titanium Level Power Supplies (80 Plus)
AC Input Voltages: 100-240 VAC
Rated Input Current: 4.2A (100V) to 1.8A (240V)
Rated Input Frequency: 50-60 Hz
Rated Output Power: 2200W
Rated Output Voltages: +5V (18A), +3.3V (15A), +12V (29A), +5Vsb (3A), -12V (0.5A)
Operating Environment
Operating Temperature: 0º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5 to 95% (non-condensing)
Regulatory Compliance
FCC, ICES, CE, VCCI, RCM, UKCA, NRTL, CB