Sun Microsystems Dual XFP, User Manual, Page: 82 / 100

64 Sun Dual 10GbE XFP PCI Express Card User’s Guide • January 2009
5. Use the
dladm show-aggr -L
command to display LACP specific information:
For more information refer to the
man
pages for
dladm
,
man dladm
.
Configuring Link Aggregation in a
Linux Environment
This section explains how to configure link aggregation in a Linux environment.
▼ To Configure Bonding for Multiple
nxge
Interfaces
1. Modify the
/etc/modprobe.conf
file for 2.6 kernels file by adding these lines:
where:
■ bond0
is the bonding device.
■
max_bonds
is the number of bond interfaces to be created.
■ mode
specifies the bonding policies.
■
miimon
is the frequency in milliseconds that MII link monitoring will occur.
Refer to Linux documentation for more information.
2. Load the bonding driver:
# dladm show-aggr -L
key: 33 (0x0021) policy: L4 address: 0:3:ba:d8:9d:e8 (auto)
LACP mode: off LACP timer: short
device activity timeout aggregatable sync coll dist defaulted expired
nxge0 passive short yes no no no no no
nxge1 passive short yes no no no no no
alias bond0 bonding
options bonding max_bonds=2 mode=4 miimon=1000
# modprobe bonding