DocID025832 Rev 2
STM32F042xx
Package characteristics
115
Figure 47. UFQFPN28 - 4
x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package outline
1. Drawing is not to scale.
2. Dimensions are in millimeters.
3. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
X
4
E
B
3EATING
0LANE
!
!
#OX
0INCORNER
,
,
2O4YP
$ETAIL:
$
$
%
%
0IN)$
3EATING
0LANE
"
!
$ETAIL:
!"?-%?6
Table 70. UFQFPN28 – 4
x 4 mm, 28-lead ultra thin fine pitch quad flat no-lead package
mechanical data
Symbol
millimeters
inches
(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
-0.05
0
0.05
-0.002
0
0.002
D
3.9
4
4.1
0.1535
0.1575
0.1614
D1
2.9
3
3.1
0.1142
0.1181
0.122
E
3.9
4
4.1
0.1535
0.1575
0.1614
E1
2.9
3
3.1
0.1142
0.1181
0.122
L
0.3
0.4
0.5
0.0118
0.0157
0.0197
L1
0.25
0.35
0.45
0.0098
0.0138
0.0177
T
-
0.152
-
-
0.006
-
b
0.2
0.25
0.3
0.0079
0.0098
0.0118
e
-
0.5
-
-
0.0197
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
