DocID025743 Rev 3
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STM32F031x4 STM32F031x6
Package information
109
7.7
TSSOP20 package information
Figure 46.TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package outline
1.
Drawing is not to scale.
Table 67. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package mechanical data
Symbol
millimeters
inches
(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.200
-
-
0.0472
A1
0.050
-
0.150
0.0020
-
0.0059
A2
0.800
1.000
1.050
0.0315
0.0394
0.0413
b
0.190
-
0.300
0.0075
-
0.0118
c
0.090
-
0.200
0.0035
-
0.0079
D
(2)
6.400
6.500
6.600
0.2520
0.2559
0.2598
E
6.200
6.400
6.600
0.2441
0.2520
0.2598
E1
(3)
4.300
4.400
4.500
0.1693
0.1732
0.1772
e
-
0.650
-
-
0.0256
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
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微可Vicor——值得信赖的元器件供应商
http://www.vicor.top/
021-31660491
微可Vicor——值得信赖的元器件供应商
http://www.vicor.top/
021-31660491