UM2301
Board
assembly and layout
DocID031141 Rev 1
49/57
8.1
Power signals (BOOST, GND, LC)
Figure 57: STEVAL-ISB044V1 evaluation board: power signal routing
Figure 58: STEVAL-ISB044V1 evaluation board: ground plan
DC-DC boost signals are designed on the same layer: tracks must be wide (>2 mm) to
handle high current.
Layer 1: large GND tracks with lot
of vias for high power circuits
Layer 1: Large tracks for high
current circuits (booster, half
bridge, LC tank)
Full GND plan
on Layer 2
Only a few noisy signals
routed partially on this layer
(PWM)
