38
38
MZ-N910
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3.0V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode(servo on).
no mark : PLAYBACK(SERVO ON)
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
c
: DIGITAL IN
F
: ANALOG IN
f
: RECORD
• Abbreviation
3CED : Spanish, Swedish, Portuguese and Finnish model
4CED : French, German, Dutch model
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
6-2. Note for Printed Wiring Board and Schematic Diagrams
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
• Waveforms
surface
*
Replacement of IC501,IC801 on MAIN board requires a
special tool.
*
Replacement of IC501,IC801 on MAIN board requires a
special tool.
• Lead Layouts
Lead layout of conventional IC
CSP (chip size package)
5
IC801
2
(OSCO)
(at the point of R806)
44.3ns
2
IC501
rd
(TE)(SL501)
500mV/DIV, 1ms/DIV
7
IC901
yd
(CLK)
6
IC801
<z,/
(UOSCO)
(USB mode)
(at the point of R823)
3
IC501
rs
(FE)(SL502)
1
IC501
9
(RFO)(AP1517)
500mV/DIV, 200ns/DIV
4
IC601
4
(CLK)
1V/DIV, 2
µ
s/DIV
5.67
µ
s
8
IC301
9
(MCLK)
2Vp-p
560mVp-p
1.4Vp-p
2.4Vp-p
2.5Vp-p
1V/DIV, 40ns/DIV
88.6ns
9
IC301
8
(BCLK)
(REC mode)
1V/DIV, 100ns/DIV
354ns
0
IC301
q;
(LRCK)
(REC mode)
22.7
µ
s
2.5Vp-p
2.4Vp-p
1V/DIV, 10
µ
s/DIV
20.8ns
3.2Vp-p
1V/DIV, 2
µ
s/DIV
5.67
µ
s
2.4Vp-p
200mV/DIV, 1ms/DIV
300mVp-p
500mV/DIV, 20ns/DIV
1V/DIV, 10ns/DIV
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
✩
When IC851 is damaged, replace the MAIN board.
