STR-DH820
STR-DH820
54
54
5-40. PRINTED WIRING BOARD – HEADPHONE Board –
• See page 21 for Circuit Boards Location. •
: Uses unleaded solder.
5-41. SCHEMATIC DIAGRAM – HEADPHONE Board –
5-42. PRINTED WIRING BOARD – TEMP-SENSOR Board –
• See page 21 for Circuit Boards Location. •
: Uses unleaded solder.
5-43. SCHEMATIC DIAGRAM – TEMP-SENSOR Board –
1
A
B
C
D
E
F
G
2
3
4
5
6
J790
1
5
3
CNP790
C792
C790
C791
CL790
CL792
CL793
CL791
PHONES
HEADPHONE
BOARD
1-883-412-
11
(11)
1
A
B
C
D
E
2
3
4
5
6
7
A250
16
CN250
3
THR251
R252
R251
THR252
C250
JL250
JL252
JL251
JL253
(CHASSIS)
1-883-416-
11
(11)
TEMP-SENSOR BOARD
1
A
B
C
2
3
4
5
6
HEADPHONE BOARD
CL790
CL791
CL792
CL793
1
3
4
5
CN790
5P
HP_DETECT
HP_R
HP_GND
HP_L
1000p
C792
1000p
C791
1000p
C790
SIGN4
SIGN2
J790
PHONES
1
A
B
C
D
E
2
3
4
5
6
TEMP-SENSOR BOARD
JL250
JL251
JL252
JL253
3
4
5
6
CN250
6P
NC
1
+5V_DIGITAL
DGND
TEMP1
TEMP2
THR252
THR251
2.2k
R252
2.2k
R251
C250
0.1