SCD-XE800
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ABOUT THE REMOTE COMMANDER USED IN THE
SERVICE MODE
When the service mode is operated, the following, remote com-
mander is necessary.
(The service mode cannot be operated by remote commander to
which this machine is attached)
Remote commander (RM-ASP004): Part No. 1-479-272-21
Note:
Above-mentioned remote commander is one example. If it is the
one printed under a remote commander as “DVD”, any remote com-
mander can be operated.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Summary of Contents for SCD-XE800
Page 4: ... Bottom view ...
Page 6: ...SCD XE800 2 3 POWER BOARD 2 4 PANEL LOADING 6 ...
Page 7: ...SCD XE800 2 5 FRONT PANEL BLOCK 2 6 CD MECHANISM DECK BLOCK CDM66F1 DVBU101 Note 1 ß 7 ...
Page 8: ......
Page 9: ...SCD XE800 2 9 BASE UNIT 2 10 OPTICAL PICK UP BLOCK KHM 313CAB 9 ...
Page 14: ......
Page 15: ......
Page 17: ......
Page 18: ......
Page 19: ......
Page 20: ......
Page 21: ......
Page 22: ......
Page 23: ......
Page 24: ......
Page 25: ......
Page 26: ......
Page 27: ......
Page 37: ...SCD XE800 5 2 CHASSIS SECTION 37 ...
Page 38: ...SCD XE800 5 3 MECHANISM DECK SECTION CDM66F1 DVBU101 38 ...