MZ-NE410/NE410CK
40
40
6-4.
Printed Wiring Board – MAIN Board (Side B) –
:Uses unleaded solder.
• Semiconductor
Location
Ref. No.
Location
D371
D-10
D605
C-3
D652
H-9
D653
C-5
D654
B-6
D851
B-10
D901
C-8
D902
D-8
IC501
D-6
IC601
B-3
IC651
B-4
IC801
E-4
IC852
C-2
IC901
C-8
Q651
B-6
Q652
B-6
Q653
C-5
Q654
B-4
Q672
B-5
Q871
B-9
IC801
IC852
IC601
IC651
IC901
IC501
MAIN BOARD
(SIDE B)
5
4
1
3
1 6
1 7
1
6 4
4 9
4 8
3 2
3 3
*
CSP(Chip Size Package)
*
CSP(Chip Size
Package)
1 0
1
1
M
10
U
U
N
V
W
N
V
W
M602
(SLED)
M601
(SPINDLE)
M603
OVER WRITE
HEAD UP/DOWN
R E C H A R G E A B L E
B A T T E R Y
N H - 7 W M A A
1 . 2 V
O R
D R Y B A T T E R Y
S I Z E " A A "
( I E C D E S I G N A T I O N L R 6 )
1 . 5 V
SWITCH
&
LCD MODULE
OVER WRITE HEAD
W601
W602
J304
S807
HOLD
OFF
ON
TP1915
TP1655
11
(11)
1 - 6 8 6 - 3 1 8 -
(US)
(US)
BATT-(GND)
(VREC)
(TEST)
(VC01)
(VOUT)
(REG01)
(REG03)
W903
SL802
(OPEN/CLOSE)
1
2
A
B
C
D
E
F
G
H
I
3
4
5
6
7
8
9
10
11
Summary of Contents for MZ-NE410 Notes on installing & operating OpenMG
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