Sony MDS-B5, Service Manual

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Note:
• SEMICONDUCTORS
In each case, u: µ , for example:
uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,
uPC...: µ PC..., uPD...: µ PD...
• CAPACITORS
uF : µ F
• COILS
uH : µ H
• Abbreviation
CND : Canadian model
• Due to standardization, replacements in the parts list
may be different from the parts specified in the
diagrams or the components used on the set.
• Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
• RESISTORS
All resistors are in ohms
METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
The components identified by mark !
or dotted line with mark ! are critical
for safety.
Replace only with part number speci-
fied.
Les composants identifiés par une
marque
! sont critiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro spécifié.
When indicating parts by reference
number, please include the board
name.
Ref. No. Part No. Description Remark
*
1-662-432-11 232C BOARD
**********
< FERRITE BEAD >
FB701 1-236-129-11 ENCAPSULATED COMPONENT
FB702 1-236-129-11 ENCAPSULATED COMPONENT
FB703 1-236-129-11 ENCAPSULATED COMPONENT
FB704 1-236-129-11 ENCAPSULATED COMPONENT
FB705 1-236-129-11 ENCAPSULATED COMPONENT
FB706 1-236-129-11 ENCAPSULATED COMPONENT
FB707 1-236-129-11 ENCAPSULATED COMPONENT
< JACK >
*
J701 1-766-194-11 CONNECTOR, D-SUB 9P (RS-232C)
J703 1-562-837-21 JACK (REMOTE)
**************************************************************
*
1-662-435-11 A IN BOARD
**********
< FERRITE BEAD >
FB801 1-236-163-11 ENCAPSULATED COMPONENT
FB802 1-236-163-11 ENCAPSULATED COMPONENT
FB803 1-236-163-11 ENCAPSULATED COMPONENT
FB804 1-236-163-11 ENCAPSULATED COMPONENT
< JACK >
J801 1-750-786-11 CONNECTOR (XLR TYPE) 3P (ANALOG IN)
**************************************************************
*
1-662-436-11 A OUT BOARD
***********
< FERRITE BEAD >
FB805 1-236-163-11 ENCAPSULATED COMPONENT
FB806 1-236-163-11 ENCAPSULATED COMPONENT
FB807 1-236-163-11 ENCAPSULATED COMPONENT
FB808 1-236-163-11 ENCAPSULATED COMPONENT
< JACK >
J802 1-750-785-11 CONNECTOR (XLR TYPE) 3P (ANALOG OUT)
**************************************************************
Ref. No. Part No. Description Remark
*
A-4699-176-A ADIO BOARD, COMPLETE
*********************
< CAPACITOR >
C801 1-104-665-11 ELECT 100uF 20% 16V
C802 1-104-665-11 ELECT 100uF 20% 16V
C809 1-104-665-11 ELECT 100uF 20% 16V
C810 1-104-665-11 ELECT 100uF 20% 16V
C811 1-124-907-11 ELECT 10uF 20% 50V
C812 1-124-907-11 ELECT 10uF 20% 50V
C813 1-124-478-11 ELECT 100uF 20% 25V
C814 1-124-478-11 ELECT 100uF 20% 25V
C815 1-124-478-11 ELECT 100uF 20% 25V
C816 1-124-478-11 ELECT 100uF 20% 25V
C825 1-104-527-11 FILM CHIP 100PF 5% 50V
C826 1-104-527-11 FILM CHIP 100PF 5% 50V
C827 1-104-527-11 FILM CHIP 100PF 5% 50V
C828 1-104-527-11 FILM CHIP 100PF 5% 50V
C829 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C830 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C833 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C834 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C835 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C836 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C839 1-104-665-11 ELECT 100uF 20% 16V
C840 1-104-665-11 ELECT 100uF 20% 16V
C872 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C873 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C874 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C875 1-124-779-00 ELECT CHIP 10uF 20% 16V
C876 1-164-232-11 CERAMIC CHIP 0.01uF 50V
C877 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C878 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C879 1-163-239-11 CERAMIC CHIP 33PF 5% 50V
C880 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C881 1-163-038-91 CERAMIC CHIP 0.1uF 25V
C882 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C885 1-165-319-11 CERAMIC CHIP 0.1uF 50V
C886 1-165-319-11 CERAMIC CHIP 0.1uF 50V
C887 1-165-319-11 CERAMIC CHIP 0.1uF 50V
C888 1-165-319-11 CERAMIC CHIP 0.1uF 50V
C891 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C892 1-163-263-11 CERAMIC CHIP 330PF 5% 50V
232C A IN
A OUT
SECTION 7
ELECTRICAL PARTS LIST
ADIO