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NW-HD5
25
25
NW-HD5
5-7. SCHEMATIC DIAGRAM – MAIN Section (2/7) –
•
See page 32 for IC Block Diagram.
C3011
C3009
C3005
C3006
C3017
C3015
C3018
C3013
C3012
C3010
R3014
R3015
C3001
C3002
R3005
VDR3001
VDR3002
C3003
R3004
C3004
L3001 100
µ
H
100
µ
H
L3002
R3002
R3010
R3006
VDR3003
VDR3004
R3026
R3027
R3028
IC1101
C1103
C1101
R1103
R1112
SP3002
SP3003
SP1101
SP1110
TP1110
SP1100
SP1103
SP1104
R3018
R3011
C3008
C3007
R3016
R3017
X3001
IC1102
C1107
C1105
R1107
SP1116
SP1117
FB1102
FB1101
0.1
0.1
1
0.1
0.1
0.1
0.1
1
0.1
0.1
0
0
0.1
1
0
100p
220
0.1
470k
470k
470k
0
0
0
MBM29SL800BE
-90PT
0.1
100p
100k
0
0
0
0.1
0.1
0
1M
22.579MHz
MBM29SL800BE
-90PT
0.1
100p
100k
0
0
GAND_A
GAND_D
GANDHI_CNT
XRESET_1.8V
RDY_XBUSY
XINT_DENDE
DATA_READY
GDAC_PCMD
GDAC_BCK
CDIF_XRDE
3.3V
1.5V
GND
CDIF_LRCK
CDIF_BCK
CDIF_PCMD
DENDE_COMAND
XRESET_DENDE
WAKEUP_DENDE
DENDE_SREQ
GDAC_LRCK
1.9V
DENDE_SS
DENDE_SO
DENDE_SI
DENDE_SCLK
XINT_D
XINT_D
DATA_R
DATA_R
DENDE_S
DENDE_S
WAKEUP_D
WAKEUP_D
XRESET_D
XRESET_D
GD0
GD1
GD2
GD3
GD4
GD5
GD6
GD7
GD8
GD9
GD10
GD11
GD12
GD13
GD14
GD15
GA1
GA9
GA10
GA11
GA12
GA13
GA14
GA15
GA16
GA17
GA20
GA18
GA8
GA7
GA6
GA5
GA4
GA3
GA2
GA19
X
C
S
0
X
R
D
X
W
E
GD0
GD1
GD2
GD3
GD4
GD5
GD6
GD7
GD8
GD9
GD10
GD11
GD12
GD13
GD14
GD15
X
C
S
1
X
R
D
GA1
GA9
GA10
GA11
GA12
GA13
GA14
GA15
GA16
GA17
GA20
GA18
GA8
GA7
GA6
GA5
GA4
GA3
GA2
GA19
(2/7)
∗
CSP(Chip Size Package)
FLASH MEMORY
(NOT SUPPLIED)
∗
CSP(Chip Size Package)
FLASH MEMORY
(NOT SUPPLIED)
(E,TW,KR,CH,JE)
Note: When IC1101 and IC1102 (IC1102 is mounted only E, Tai-
wan, Korean, Chinese and Tourist models) on the MAIN
board are damaged, exchange the new MAIN board for the
MAIN board which IC damaged.