NW-HD5
21
21
NW-HD5
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
Power voltage is dc 4.2 V and fed with regulated dc power
supply from TP9010 and TP9011 on the MAIN board.
•
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Circled numbers refer to waveforms.
•
Signal path.
F
: AUDIO
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
surface
Lead layout of conventional IC
CSP (chip size package)
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
•
When IC1101 and IC1102 (IC1102 is mounted only E,
Taiwan, Korean, Chinese and Tourist models) on the MAIN
board are damaged, exchange the new MAIN board for
the MAIN board which IC damaged.
•
Waveform
44.3 ns
1.9 Vp-p
30.5
µ
s
1 Vp-p
– MAIN Board –
1
X1002
500 mV/DIV, 20 ns/DIV
2
IC9503
7
(OSCIN)
200 mV/DIV, 10
µ
s/DIV
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
•
When IC1101 and IC1102 (IC1102 is mounted only E,
Taiwan, Korean and Tourist models) on the MAIN board
are damaged, exchange the new MAIN board for the MAIN
board which IC damaged.
•
MAIN and HDD boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
•
Lead Layouts
*
Replacement of IC1003, 2001, 3001, 7001, 7002 and
9003 used in this set requires a special tool.
*
Replacement of IC1003, 2001, 3001, 7001, 7002 and
9003 used in this set requires a special tool.
•
Note for Printed Wiring Boards and Schematic Diagrams
•
Abbreviation
CH
: Chinese model
JE
: Tourist model
KR
: Korean model
TW
: Taiwan model
