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HCD-GX8000/RG77
28
28
IC103
A
B
C
D
1
2
3
4
M102
(SLED)
2
8
7
1
M101
(SPINDLE)
OPTICAL PICK-UP
BLOCK
(A-MAX.3)
TP
(DVC)
TP
(RFAC)
TP
(FEI)
TP
(FEO)
TP
(TEO)
(RFDC)
Approx.
0.3 Vp-p
7-6.
PRINTED WIRING BOARD – BD Board –
•
See page 27 for Circuit Boards Location.
qg
IC501
qd
(X-OUT)
qf
IC501
qa
(XC-OUT)
2.4 Vp-p
30.5
µ
s
1.9 Vp-p
62.5 ns
• Waveforms
– BD Board –
1.1
±
0.4 Vp-p
1
IC103
qg
(RFAC) (CD Play Mode)
2.5 Vp-p
7.5
µ
s
2
IC101
wh
(MDP) (CD Play Mode)
3
IC101
el
(FE) (CD Play Mode)
4
IC101
ra
(TE) (CD Play Mode)
0.65
±
0.15 Vp-p
5
IC101
5 Vp-p
59 ns
2.1 Vp-p
12.1
µ
s
qa
Q302, Q303 (Base) (REC Mode)
10.8Vp-p
12.1
µ
s
qs
Q302, Q303 (Collector) (REC Mode)
6
IC101
yj
(XTAO)
– MAIN Board –
0.4 Vp-p
12.1
µ
s
Q302, Q303 (Emitter) (REC Mode)
2.8 Vp-p
250 ns
wa
IC601
is
(X0)
– PANEL Board –
• Semiconductor
Location
Ref. No.
Location
D101
B-4
IC101
C-3
IC102
B-2
IC103
D-2
Q101
C-1
Q102
B-4
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9
9
2
8
9
4
2
9
8
T E L
1 3 9 4 2 2 9 6 5 1 3
9
9
2
8
9
0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299