Sony HCD-GTK1i, Service Manual

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HCD-GTK1i/GTK2i
HCD-GTK1i/GTK2i
15 15
For Schematic Diagrams.
Note:
• All capacitors are in μ F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
speci fi ed.
•
2
: non fl ammable resistor.
•
C
: panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M

).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
I
: IPOD
f
: TUNER
J
: USB
• Abbreviation
AR :
Argentina model
AUS : Australian model
CND : Canadian model
E2
: 120V AC area in E model
E4 : African model
E51 : Chilean and Peruvian model
MX : Mexican model
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Abbreviation
AR :
Argentina model
AUS : Australian model
CND : Canadian model
E2
: 120V AC area in E model
E4 : African model
E51 : Chilean and Peruvian model
MX : Mexican model
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Waveforms
– MAIN Board – – IPOD Board –
Note:
The components identi-
fi ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
fi ed.
Note:
Les composants identi fi és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une piéce portant le nu-
méro spéci
fi é.
1 IC102
qh
(CLK IN)
200mV/DIV, 24.6msec/DIV
2 IC100
qd
(/X-OUT)
100mV/DIV, 12.3msec/DIV
50 Hz
556.7 mVp-p
376mHz
266.7 mp-p
3 IC1100
ra
(X OUT-PLL)
100mV/DIV, 49.3nsec/DIV
30 MHz
320.0mVp-p