HBD-E2100/E3100/E4100/E6100
HBD-E2100/E3100/E3200/E4100/E6100
42
42
Note:
The components identi
fi
ed by mark
0
or
dotted line with mark
0
are critical for safety.
Replace only with part number speci
fi
ed.
Note:
Les composants identi
fi
és par une marque
0
sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spéci
fi
é.
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
f
: internal component.
•
C
: panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MB1002 board is multi-layer printed board. However, the
patterns of intermediate-layers have not been included in
this diagrams.
• Abbreviation
AR :
Argentina
model
AUS :
Australian
model
CH
: Chinese model
CND : Canadian model
E3
: 240 V AC area in E model
E12
: 220 – 240 V AC area in E model
E32
: 110 – 240 V AC area in E model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX6 : Latin-American model
PX
: PX model
RU
: Russian model
SAF : South African model
SP
: Singapore model
TH :
Thai
model
TW :
Taiwan
model
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C E
Q
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
*
Replacement of IC102 and IC103 on the MB1002 board used
in this unit requires a special tool.
Note:
When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND
IC3302 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on servicing notes (page 10).
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : TUNER
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
f
:
TUNER
L
:
USB
E
:
VIDEO
d
:
LAN
J
: DISC PLAY
N
: MIC
• Abbreviation
AR :
Argentina
model
AUS :
Australian
model
CH
: Chinese model
CND : Canadian model
E3
: 240 V AC area in E model
E12
: 220 – 240 V AC area in E model
E32
: 110 – 240 V AC area in E model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX6 : Latin-American model
PX
: PX model
RU
: Russian model
SAF : South African model
SP
: Singapore model
TH :
Thai
model
TW :
Taiwan
model
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Note:
When the AMP board is replaced, spread the compound
referring to “NOTE OF REPLACING THE IC3102 AND
IC3302 ON THE AMP BOARD AND THE COMPLETE
AMP BOARD” on servicing notes (page 10).
*
Replacement of IC102 and IC103 on the MB1002 board used
in this unit requires a special tool.
• Waveforms
– MB1002 Board –
