– 27 –
– 28 –
6-7. PRINTED WIRING BOARD — CD SECTION — • Refer to page 18 for Circuit Boards Location.
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
10
04
TP
(RF)
C763
C764
C773
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
b
: Pattern from the side which enables seeing.
IC701
H-7
IC702
E-5
IC703
B-5
Q701
F-8
Q702
J-7
• Semiconductor
Location
Ref. No.
Location
CFD-S22/S32
(Page 33)
• Waveforms
(MODE: PLAY)
1
2.2Vp-p
2
16.9344MHz
IC702
yj
(XTAO)
3
4
2.5V
5
1.2±0.3Vp-p
Approx. 200mVp-p
IC701
qd
(FE)
7.6
µ
sec
2Vp-p
IC702
wh
(MDP)
IC701
qg
(RFO)
2.5V
Approx. 100mVp-p
IC701
qa
(TE)
100mV/div 20nsec/div
100mV/div 2
µ
sec/div
50mV/div 500nsec/div
100mV/div 1
µ
sec/div
100mV/div 1
µ
sec/div
