40
SECTION 9
ELECTRICAL PARTS LIST
JACK LSW MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
*
1-675-515-11 JACK BOARD
***********
< CAPACITOR >
C901
1-162-964-11 CERAMIC CHIP
0.001uF
10%
50V
C902
1-164-360-11 CERAMIC CHIP
0.1uF
16V
C904
1-162-927-11 CERAMIC CHIP
100PF
5%
50V
< CONNECTOR >
CN901
1-779-077-61 PLUG, CONNECTOR
(CONTROL, ANALOG OUT)
CNJ901 1-778-775-21 CONNECTOR, FPC 13P
< DIODE >
D901
8-719-069-57 DIODE UDZS-TE17-6.8B
D902
8-719-069-57 DIODE UDZS-TE17-6.8B
< FERRITE BEAD >
FB901
1-500-445-21 FERRITE
0uH
FB902
1-500-445-21 FERRITE
0uH
FB903
1-500-445-21 FERRITE
0uH
< IC >
IC901
1-532-686-21 LINK, IC
**************************************************************
1-572-688-11 SWITCH, PUSH (1 KEY) (LIMIT)
**************************************************************
A-3294-985-A MAIN BOARD, COMPLETE
1-676-339-12 MAIN FLEXIBLE BOARD
1-676-340-12 JACK FLEXIBLE BOARD
< CAPACITOR >
C101
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C102
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C103
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C104
1-162-970-11 CERAMIC CHIP
0.01uF
10%
25V
C110
1-162-965-11 CERAMIC CHIP
0.0015uF 10%
50V
C111
1-162-965-11 CERAMIC CHIP
0.0015uF 10%
50V
C112
1-115-467-11 CERAMIC CHIP
0.22uF
10%
10V
C120
1-162-967-11 CERAMIC CHIP
0.0033uF 10%
50V
C121
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C122
1-125-837-11 CERAMIC CHIP
1uF
10%
6.3V
C123
1-162-970-11 CERAMIC CHIP
0.01uF
10%
25V
C124
1-162-965-11 CERAMIC CHIP
0.0015uF 10%
50V
C125
1-165-176-11 CERAMIC CHIP
0.047uF
10%
16V
C126
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C127
1-162-960-11 CERAMIC CHIP
220PF
10%
50V
C129
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C130
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C140
1-162-963-11 CERAMIC CHIP
680PF
10%
50V
C141
1-162-963-11 CERAMIC CHIP
680PF
10%
50V
C142
1-164-217-11 CERAMIC CHIP
150PF
5%
50V
C143
1-164-217-11 CERAMIC CHIP
150PF
5%
50V
C144
1-126-382-11 ELECT
100uF
20%
16V
C145
1-126-382-11 ELECT
100uF
20%
16V
C201
1-107-826-11 CERAMIC CHIP
0.1uF
10%
16V
C203
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C204
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C205
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C230
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C301
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C302
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C303
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C304
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C305
1-162-964-11 CERAMIC CHIP
0.001uF
10%
50V
C306
1-162-968-11 CERAMIC CHIP
0.0047uF 10%
50V
C307
1-165-112-11 CERAMIC CHIP
0.33uF
20%
10V
C308
1-125-837-11 CERAMIC CHIP
1uF
10%
6.3V
C309
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C310
1-125-701-11 DOUBLE LAYER
0.047F
5.5V
C311
1-126-382-11 ELECT
100uF
20%
16V
C312
1-115-156-11 CERAMIC CHIP
1uF
10V
C313
1-126-382-11 ELECT
100uF
20%
16V
C314
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C315
1-115-466-00 ELECT
1000uF
20%
16V
C316
1-126-382-11 ELECT
100uF
20%
16V
C317
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C318
1-164-156-11 CERAMIC CHIP
0.1uF
25V
C401
1-162-962-11 CERAMIC CHIP
470PF
10%
50V
C402
1-162-962-11 CERAMIC CHIP
470PF
10%
50V
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. .
: µA. .
uPA. . : µPA. .
uPB. . : µPB. .
uPC. . : µPC. .
uPD. . : µPD. .
• CAPACITORS
uF: µF
• COILS
uH: µH
When indicating parts by reference
number, please include the board.
The components identified by
mark
0
or dotted line with mark
0
are critical for safety.
Replace only with part number
specified.
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