CDX-3700
– 17 –
– 18 –
3-3. PRINTED WIRING BOARDS — MAIN SECTION —
Note:
•
Y
: parts extracted from the conductor side.
•
p
: parts mounted on the conductor side.
•
®
: Through hole.
•
¢
: internal component.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
(LIMIT)
SW3
(DISC IN 2)
SW2
(DISC IN 1)
SW4
CHUCKING
DET
( )
-
+
-
+
-
+
Ref. No.
Location
(D501)
B-10
D503
B-13
D504
B-12
D505
C-11
D506
D-13
D507
D-12
D508
E-11
D509
F-11
D510
E-12
D511
B-4
D512
E-10
D513
B-8
D514
D-8
D516
B-12
D517
B-12
D518
C-12
D519
B-2
D550
C-4
D551
B-4
D552
C-4
D600
K-10
D601
K-11
D602
J-12
IC101
G-7
IC102
G-5
IC103
J-4
IC400
D-5
(IC500)
B-6
IC600
H-11
IC601
I-9
IC700
D-3
Q101
F-4
Q401
B-3
Q402
C-5
Q403
C-6
Q501
D-11
Q502
D-11
Q503
F-13
Q504
G-12
Q505
C-11
Q506
C-13
Q507
D-12
Q508
C-7
Q509
E-11
Q510
E-12
Q511
E-10
Q512
C-8
(Q513)
A-8
Q514
C-8
Q515
D-7
Q516
B-3
Q517
F-11
Q550
B-3
Q551
B-4
Q601
J-12
Q701
G-2
Q702
G-2
Q703
J-7
Q704
F-2
Q705
F-3
• Semiconductor
Location
( ) : SIDE B
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Summary of Contents for CDX-3700
Page 3: ... 3 SECTION 1 GENERAL This section is extracted from instruction manual ...
Page 4: ... 4 ...
Page 5: ... 5 ...
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