Sierra Wireless MC5720 Hardware Integration Manual Download Page 18

MC5720/8755/8765 Hardware Integration Guide 

Note:  The module can cause 
interference with other devices 
such as hearing aids and on-
board speakers. 

Wireless devices such as the 
MiniCard transmit in bursts 
(pulse transients), for set 
durations (RF burst frequencies). 
Hearing aids and speakers 
convert these burst frequencies 
into audible frequencies, 
resulting in audible noise. 

Device-generated RF 

All

 

electronic

 

computing

 

devices

 

generate

 

RF

 

interference

 

that

 

can

 

negatively

 

affect

 

the

 

receive

 

sensitivity

 

of

 

the

 

module

 

(RF

 

desense).

 

The

 

proximity

 

of

 

host

 

electronics

 

to

 

the

 

antenna

 

in

 

wireless

 

devices

 

can

 

contribute

 

to

 

RF

 

desense.

 

Components

 

that

 

are

 

most

 

likely

 

to

 

cause

 

RF

 

desense

 

include:

 

• 

Microprocessor

 

and

 

memory

 

• 

Display

 

panel

 

and

 

display

 

drivers

 

• 

Switching

mode

 

power

 

supplies

 

These,

 

and

 

other

 

high

speed

 

devices

 

(in

 

particular,

 

the

 

processor)

 

can

 

cause

 

RF

 

desense

 

because

 

they

 

run

 

at

 

frequencies

 

of

 

tens

 

of

 

MHz.

 

The

 

rapid

 

rise

 

and

 

fall

 

of

 

these

 

clock

 

signals

 

generates

 

higher

order

 

harmonics

 

that

 

often

 

fall

 

within

 

the

 

operating

 

frequency

 

band

 

of

 

the

 

module,

 

causing

 

RF

 

desense.

 

Example 

On

 

a

 

sub

system

 

running

 

at

 

40

 

MHz,

 

the

 

22nd

 

harmonic

 

falls

 

at

 

880

 

MHz,

 

which

 

is

 

within

 

the

 

cellular

 

receive

 

frequency

 

band.

 

Note:  In practice, there are usually numerous interfering frequencies 
and harmonics. The net effect can be a series of desensitized receive 
channels. 

16 

2130114 

Summary of Contents for MC5720

Page 1: ...2130114 Rev 0 92 MC5720 MC8755 MC8765 MiniCard Hardware Integration Guide Proprietary and Confidential...

Page 2: ......

Page 3: ...ts occurrences or claims giving rise to liability be in excess of the price paid by the purchaser for the Sierra Wireless product Portions of this product may be covered by some or all of the followin...

Page 4: ...osoft Corporation Qualcomm is a registered trademark of Qualcomm Incorpo rated Other trademarks are the property of the respective owners Sales Desk Phone 1 604 232 1488 Hours 8 00 AM to 5 00 PM Pacif...

Page 5: ...ic discharge ESD 9 Module power states 10 Disconnected state 10 Off state 10 Normal state 11 Low power mode 11 Usage models 11 RF Integration 13 RF connection 13 Ground connection 13 Shielding 14 Ante...

Page 6: ...Hardware Integration Guide LED output 17 Regulatory Information 19 Important notice 19 Safety and hazards 19 Important compliance information for North American users 20 Acronyms and Definitions 23 In...

Page 7: ...rstanding of network technology and experience in integrating hardware components into electronic equipment is assumed The Universal Development Kit Sierra Wireless manufactures a Universal Developmen...

Page 8: ...o power supply integration 3 RF Integration p 13 Describes antenna connection methods and grounding issues RF interference and desense issues 4 Host Module Communication Interface p 17 Describes the U...

Page 9: ...ations Part 15 Radio Frequency Devices This section of the FCC Code of Federal Regulations Title 47 deals with radio frequency devices including EM shielding requirements The regulation can be downloa...

Page 10: ...describes SIM testing methods The document 3GPP TS 11 10 4 can be downloaded from www 3gpp org PCI Express Mini Card Electromechanical Specification Revision 1 1 The document can be downloaded from ww...

Page 11: ...ower supply as indicated in PCI Express Mini Card Electromechanical Specifi cation Revision 1 1 The MC8755 8765 has more power pins than the MC5720 due to higher peak current requirements for GSM devi...

Page 12: ...utdown Low power airplane mode The module is active but RF is disabled State machines are implemented in the module to monitor the power supply and operating temperature Disconnected state This state...

Page 13: ...r User Equipment UE Release 6 CFUN 0 command EM5625 MC5720 CnS Reference Document 2130643 CNS_RADIO_POWER 0x1075 or MC87xx Modem CnS Reference Document 2130602 Disable Modem Usage models Usage models...

Page 14: ...C5720 8755 8765 Hardware Integration Guide The module automatically enters slotted sleep mode when there is no transmission or reception occurring SCI 2 Transmit power is assumed to be 3 dBm 12 213011...

Page 15: ...RF cable losses to the antenna the recommended maximum cable loss for antenna cabling is 0 5 dB Figure 3 1 Antenna connection points and mounting holes Ground connection When connecting the module to...

Page 16: ...stom designed antennas A skilled RF engineer should do the development to ensure that the RF performance is maintained Identify the bands that need to be supported particularly when both the MC5720 an...

Page 17: ...e RF signal The power supply ripple limit for the module is no more than 200 mVp p 1 Hz to 100 kHz This limit includes voltage ripple due to transmitter burst activity Interference from other wireless...

Page 18: ...reless devices can contribute to RF desense Components that are most likely to cause RF desense include Microprocessor and memory Display panel and display drivers Switching mode power supplies These...

Page 19: ...iniCard specification summarized in Table 4 1 Module is transmitting LED is flashing intermittently or receiving proportional to activity on the interface 50 duty cycle 3 Hz minimum blink rate 20 Hz m...

Page 20: ...MC5720 8755 8765 Hardware Integration Guide Figure 4 1 Example LED VCC 3 3V Current limiting Resistor LED MIO MiniCard 18 2130114...

Page 21: ...0 MC8755 MC8765 modem In areas where blasting is in progress Where explosive atmospheres may be present including refuelling points fuel depots and chemical plants Near medical equipment Near life sup...

Page 22: ...the MC5720 3 The MC5720 MC8755 MC8765 modem and its antenna must not be co located or operating in conjunction with any other transmitter or antenna within a host device 4 A label must be affixed to t...

Page 23: ...atory Information Note If this module is intended for use in a portable device you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2 1093 and IC RSS 102 Rev 0 92 Nov...

Page 24: ...MC5720 8755 8765 Hardware Integration Guide 22 2130114...

Page 25: ...rence voltage dBm Decibels relative to 1 mW Decibel mW 10 x log10 Pwr mW 1mW DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EM Embedded Module ESD ElectroStatic Discharge FER Frame E...

Page 26: ...al that the receiver can measure Sensitivity RF Measure of lowest power signal at the receiver input that can provide a prescribed BER BLER SNR value at the receiver output SIM Subscriber Identity Mod...

Page 27: ...e RF disconnected module power state 10 diversity antenna disabling 15 E electrostatic discharge See ESD ESD protection requirements 9 10 testing techniques document IEC 61000 4 2 7 F FCC regulations...

Page 28: ...ument See PSD PSD MC5720 details 7 MC8755 8765 details 7 R regulatory information 19 21 FCC 20 limitation of liability 19 safety and hazards 19 RF antenna cable loss maximum 13 antenna connection cons...

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