Rev 3.0 Aug.19
23
41111116
3
3: Thermal Profile for SMD Modules
The following information is Pb-Free compliant. The details are for reference only.
SMT Reflow Soldering Temperature Profile
•
Solder paste alloy: SAC305 (Sn96.5/Ag3.0/Cu0.5).
•
Pre-heat Temp: 150–200°C; Soak time (ts): 60–120sec.
•
Peak temp (Tp)
≤
250°C.
•
Time above 220°C (tp): 40–90sec.
•
Optimal cooling rate < 3°C/sec, from peak to 220°C.
•
The oxygen concentration < 2000 ppm.
Figure 3-1: SMT Reflow Soldering Temperature Profile
SMT Solder Mask
Using the dimensions of the PCB pad as a reference, subtract the size by 0.1 to 0.2
mm and use that as a layout for the paste mask (for a PCB pad layout, please see
“Recommended PCB pad layout” on the individual GPS module data sheet).
Manual Soldering
Soldering iron: Bit Temperature: under 380°C | Time: under 3 seconds.