Sierra Wireless AirPrime HL Series, Customer Process Manuallines

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4115102 Rev 1.1 February 21, 2014 14
4. SMT Assembly Process
This section presents information and recommendations for the industrial assembly of the AirPrime
Snap-in socket on the application.
Note: The AirPrime Snap-in socket should be assembled by reflow process.
4.1. Lead-Free Process
In compliance with directive 2011/65/CE, Sierra Wireless products do not contain the following
hazardous substances:

mercury (Hg),

lead (Pb),

cadmium (Cd),

hexavalent chromium (Cr+6),

polybrominated diphenyl ether (PBDE),

polybrominated biphenyl (PBB).
The AirPrime snap-in sockets are manufactured with RoHS compliant components and processes.
4.2. PCB Design Requirements
4.2.1. PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel, immersion Gold. Organic Solderability
Preservative (OSP) may also be used.
Caution: Hot Air Solder Leveled finish (HASL) is not recommended because the process does not give
consistent solder volumes on each pad because of poor pad flatness.