Product overview
2.4 Properties
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01
21
Properties of the connection technology
Table 2- 3
Properties of the connection technology
Properties of the connection technology
Explanation
Twistable front connector
Rapid module exchange during maintenance
(cable duct remains closed)
Pre-wiring positioning
•
Efficient module wiring (easily accessible)
•
No loosening of the wiring when replacing a
module
•
No electrical damage to the module is
possible, because it is not yet electrically
connected
Development of potential groups by the insertion
of potential bridges
Reduced wiring effort on the front cable
connector
Integrated EMC concept (power supply element,
shielding bracket, and terminal element)
Optimization of the interference emission and
interference immunity
Consistent pin assignment of the module types
Minimization of wiring errors
Consistent 40-pin front connector for all modules,
with a width of 35 mm
Simplified ordering
Two snap-in positions of the front cover
Flexible cable storage space
Automatic coding of the I/O modules and front
cable connectors
Safe replacement of modules
Large label
Sufficient space for clear labeling
Summary of Contents for simatic ET 200MP
Page 4: ...Preface ET 200MP Distributed I O System 4 System Manual 01 2013 A5E03723484 01 ...
Page 8: ...Table of contents ET 200MP Distributed I O System 8 System Manual 01 2013 A5E03723484 01 ...
Page 118: ...Service Support ET 200MP Distributed I O System 118 System Manual 01 2013 A5E03723484 01 ...
Page 126: ...Index ET 200MP Distributed I O System 126 System Manual 01 2013 A5E03723484 01 ...
