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Product description
3.1
Device view
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1 2
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6 7
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1
X1 – POWER: connections for the device voltage supply
2
X2 – IO LINK MASTER: connections for IO-Link and/or GPIO
3
X3 – OUTPUT: connections for digital switching outputs
4
X4 – INPUT A: connections for digital switching inputs A
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X5 – INPUT B: connections for digital switching inputs B
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X6 – SERIAL A: serial connections A
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X7 – SERIAL B: serial connections B
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X8 – CAN: connections for SICK CAN sensor network with termination resistor which can
be activated
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X9 ... X10 - FIELDBUS: 2 connections for Ethernet-based fieldbuses
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X11 ... X14 - ETHERNET: 4 Ethernet connections
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USB connection
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2 x microSD card slot
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Device status indicators
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Function selector switch (configurable by SensorApp)
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Battery compartment
3.2
Functionality
The SIM2000ST-E Sensor Integration Machine – part of the SICK AppSpace eco-system
– is opening up new possibilities for application solutions.
Data from SICK sensors such as 1D / 2D code sensors and VMS4xx / 5xx for detecting
object geometry can be imported, evaluated, archived, and transmitted. Four fast Ether‐
net interfaces are available for sensors. In addition, data from SICK LiDAR scanners
can be read, merged into a point cloud, evaluated, archived, and transmitted. The SIM
enables SICK picoCam and midiCam as well as any GigE Vision/GenICAM compliant
cameras to be used.
Other sensors can be integrated via IO-Link, for example for distance and height meas‐
uring purposes. Depending on the application, additional sensors can be connected
for the read cycle, for detecting the object distance (e.g., MLG, as an alternative to the
VMS4xx / 5xx), and for generating the increment signal.
Fieldbus and Ethernet interfaces with OPC-UA and MQTT provide data preprocessed in
“dual talk” (edge computing) for the controller and for cloud computing. In addition, the
SIM can be integrated into a SICK CAN sensor network.
PRODUCT DESCRIPTION
3
8025454/1BLK/2021-03-30 | SICK
O P E R A T I N G I N S T R U C T I O N S | SIM2000ST-E
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Subject to change without notice