4
Mechanical installation
Preparing the mounting plate
Operating Instructions – WOP11D-70-0, WOP11D-100-0 and WOP11D-150-0
24
4.5
Preparing the mounting plate
Proceed as follows:
1. Create a cut-out in the mounting plate. For the dimensions of the required cut-out,
refer to chapter "Dimension drawings" (→
2. Ensure that the mounting plate is clean and even.
3. Make sure that the thickness of the mounting plate is 3 – 7 mm.
4.6
Unpacking
Read the following notes before you unpack the device:
•
Do not remove the device from its protective packaging while it is not being used
for operational purposes unless it is otherwise protected.
•
Unpack or pack the device only at safe EOS/ESD workplaces. If a safe workplace
cannot be guaranteed, it is important that the user is electrically discharged before
the equipment comes into direct contact with the body or with tools. The body can
be easily discharged by touching a grounded metal part, e.g. the system housing.
•
Do not put the device on conductive surfaces including anti-static plastics or
sponges. They may cause short circuits and damage the batteries or circuits of the
device.
Proceed as follows when unpacking the device:
1. Unpack the delivery and check it.
2. Inform your supplier immediately in the event of damage.
26860481/EN – 03/2021
