SEW-Eurodrive Movigear Performance MGF**-DFC-C Series, Operating Instructions Manual

Page: 66 / 416

5
Electrical installation
Installation planning taking EMC aspects into account
Operating Instructions – MOVIGEAR
®
performance
66
5.1.4 Equipotential bonding
Regardless of the PE connection, it is essential that low-impedance, HF-capable
equipotential bonding is provided (see also EN 60204-1 or DIN VDE 0100-540):
• Provide for a connection over a wide area between the device and the mounting
rail.
• To do so, use a ground strap (HF litz wire), for example, to connect the device and
the grounding point of the system.
Example
[3]
[2]
[4]
[1]
25167264651
[1] The mechanical installation of a drive unit with hollow shaft does not create a
conductive connection of drive unit and mounting plate (e.g. in case of
MOVIGEAR
®
performance).
[2] PE conductor in the supply system cable
[3] 2nd PE conductor via separate terminals
[4] EMC-compliant equipotential bonding, for example using a ground strap (HF litz
wire)
The contact surfaces must be free of paint.
• Do not use the cable shields of data lines for equipotential bonding.
INFORMATION
For detailed information on equipotential bonding for decentralized inverters and
drive units, refer to the publication "Equipotential Bonding of Decentralized Inverters"
by SEW‑EURODRIVE.
25945475/EN – 04/2019