Samsung SRP-350PG - SRP 350 B/W Direct Thermal..., Service Manual

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PCB Layout and Parts List
Samsung Electro-Mechanics
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-4 IEEE 1284 Parallel I/F PCB
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-4-1 Component and Solder Side
(New)
11-
4
-2 Parts List
(New)
CODE NO DESCRIPTION / SPECIFICATION Q'TY REMARK Serviceable
AP04-00050A PBA Ass'y IEEE1284 1 Y
0401-001003 DIODE-SWITCHING,MMBD6050LT,70V200m 1 D1 Y
0404-001051 DIODE-SCHOTTKY,SK14,40V,3A,DO-201 1 D2 Y
0801-000408 IC-CMOS LOGIC,74HC02,NOR GATE,SOP 1 U3 Y
0801-000454 IC-CMOS LOGIC,74HC74,D FLIP-FLOP 1 U1 Y
0801-000718 IC-CMOS LOGIC,74HC574,D FLIP-FLOP 2 U4,U5 Y
0801-000891 IC-CMOS LOGIC,74HCT32,OR GATE,SOP 1 U6 Y
2007-000028 R-CHIP,39ohm,5%,1/10W,2012 1 R4 Y
2007-000493 R-CHIP,2.2K Ω ,5%,1/10W,2012 1 R3 Y
2011-001094 R-NETWORK,39 Ω ,63MW,8P 2 RA1 RA2 Y
2011-001011 R-NETWORK,10K Ω ,63MW,8P 1 RA7 Y
2011-001097 R-NETWORK,5.1K Ω ,5%,63MW,8P 3 RA5 RA6 RA8 Y
2203-000192 C-CERAMIC,CHIP,100nF,+80-20%,50V 5 C2 C3 C5 C6 C4 Y
2203-000634 C-CERAMIC,CHIP,0.022nF,5%,50V 9
C7 C10 C11 C12 C13
C14 C15 C16 C17
Y
2203-000938 C-CERAMIC,CHIP,0.47nF,5%,50V,NPO 10
C9 C19 C20 C21 C22
C23 C24 C25 C26 C29
Y
K804-00028A C-CERAMIC,CHIP,6.8nF,5%,51V,NPO 1 C27 Y
2203-001801 C-CERAMIC,CHIP 10nF,10%,100V,X7R 3 C8 C28 Y
2402-000168 C-AL,SMD 100uF,16V,20%8.3*8.3 1 C1 Y
3301-000325 CORE-FERRITE BEAD AB,3.2*2.5*1.3,60ohm 1 L1 Y
3702-000118 CONNECTOR-RIBBON 1 CN2 Y
3702-001125 CONNECTOR-RIBBON 34P,FEMALE,ANGLE 1 CN1 Y
6001-000568 SCREW M3X8 2 Y
JE41-00469A PCB-IEEE1284 SRP-350,FR-4,T1.6 1 N
JE70-00290B IPR-BRKT PARALLEL IEEE1284 1 Y