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7. Level 2 Repair
7-4. Disassembly
※
Caution
Be care of scratch.
※
Caution
Be care of scratch.
※
Caution
Be care of Rear damage.
※
Caution
1) Be care of scratch.
2) Be care of Rear and connector damage.
2
Detach the Back Glass.
Detach the left side of Back glass.
3
Unscrew 15 Point and disassemble SIM Tray
from device.
4
Disassemble Upper Rear.
(Use disassemble hole left/right side of Rear to
detach it)
Rear Top disassemble hole.
1
Put the device in the chamber as following
below heating condition
- SOC 68%
↓: 70
℃
/10~20 minute
-
SOC 68%↑: 60
℃
/10~20 minute
※
Please confirm the heating condition
released lastly, and follow it.