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7. Level 2 Repair
7-4. Disassembly
※
Caution
Be careful not to damage set and OCTA.
※
Caution
Be care of scratch and molding damage.
※
Caution
Be care of damage to components.
※
Caution
Be careful not to damage the PBA.
1
1) Put the device in the AOD jig.
Set the AOD condition
-
SOC 68%↓: Upper 70
℃
/ Lower 60
℃
5min
-
SOC 68%↑: Upper 60
℃
/ Lower 60
℃
5min
2) Disassemble the OCTA using the AOD.
※
Below picture shows how to detach
Back Glass using service jig, however you
can use manufactural jig if possible.
2
Disassemble SIM Tray from device.
Unscrew 13Points.
3
Disassemble the REAR from Front Assy.
4
1. Disassemble Connector 3ea from PBA.
2. Unscrew 1 Points from PBA.
3. Disassemble Coaxial Cable 2ea from PBA.
커넥터 해체
3 포인트
스크류 해체 포인트
커넥터 해체
3 포인트
스크류 해체 포인트