2-6
Samsung Electronics
2-6 AUDIO
2-6-1 Audio Inputs
The Handset provides two audio inputs:
¥ Built in microphone
¥ Connection for external microphone
A microphone biasing amplifier reduces component count in the overall system design:
¥ Supply: 2.2 V regulated to ±20 %
¥ Different output to eliminate possible coupling noise problems, MICBIASP and MICBIASN
¥ Maximum current: 500 uA
¥ Maximum load: 200 pF
2-7 EXTERNAL INTERFACE
A 18 pin connector is mounted on the bottom corner of the PCB. The antenna external connection is on the
right hand side of this connector.
2-8 KERNEL SPECIFICATION
2-8-1 FEATURES
¥ Complete Layer 1 support
¥ TDMA burst building (ETSI Rec.5-02)
¥ Coding and interleaving (Rec. 5-03)
¥ GMSK with differential coding (Rec. 5-04)
¥ Programmable power template for Tx burst control
¥ AGC in Receive mode
¥ I,Q inputs or single intermediate frequency (IF) input
¥ Detection of FCCH, SCH, Normal and Dummy Bursts
¥ Flash ROM programming abilities
¥ Auxiliary ADC for battery voltage and temperature monitoring
Circuit Description
Summary of Contents for SGH 600
Page 2: ...Samsung Electronics Co Ltd ELECTRONICS ...
Page 6: ...1 4 Samsung Electronics General Description MEMO ...
Page 20: ...3 4 Samsung Electronics Specification MEMO ...
Page 40: ...7 8 Samsung Electronics Electrical Parts List MEMO ...
Page 48: ...8 8 Samsung Electronics Exploded View and its Parts List 8 9 Hands Free Kit Diagram ...
Page 49: ...Samsung Electronics 8 9 Exploded View and its Parts List 8 10 Boost Kit ...
Page 57: ......
Page 58: ......
Page 59: ......
Page 60: ......
Page 61: ......
Page 62: ......
Page 63: ......
Page 64: ......
Page 65: ......
Page 66: ......
Page 67: ......
Page 68: ......
Page 69: ......
Page 70: ......
Page 71: ......
Page 72: ......
Page 73: ......
Page 74: ......