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© SAMSUNG Electronics Co., Ltd. Confidential & Proprietary
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Hardware Guide
L7
XCP_GPIO_RSV6
XCP_GPIO_62
R25
AP_26M
XCP_GPIO_61
R27
PM_WRSTBI
XCP_GPIO_58
M32
PCIE1_RST_N
AP_XEINT_0
G6
AP_CP_WAKE
AP_XEINT_1
G8
AP2CP_NOTIFY_ACTVIE
AP_XEINT_2
G10
Reserved
AP_XEINT_3
G12
MCU2CP_WAKEUP
AP_XEINT_4
E16
XMMC_CARD1_CMD
AP_GPIO_SDIO0_CLK
B19
XMMC_CARD0_D3
AP_GPIO_SDIO0_CMD
C18
XMMC_CARD0_D0
AP_GPIO_SDIO0_D0
E20
XMMC_CARD1_D0
AP_GPIO_SDIO0_D1
C16
XMMC_CARD0_CLK
AP_GPIO_SDIO0_D2
C14
XMMC_CARD0_CMD
AP_GPIO_SDIO0_D3
B15
XMMC_CARD0_D1
AP_GPIO_SDIO1_CLK
D17
XMMC_CARD1_D2
AP_GPIO_SDIO1_CMD
B17
XMMC_CARD0_D2
AP_GPIO_SDIO1_D0
E18
XMMC_CARD1_CLK
AP_GPIO_SDIO1_D1
D19
XMMC_CARD1_D3
AP_GPIO_SDIO1_D2
D15
XMMC_CARD1_D1
AP_GPIO_SDIO1_D3
O4
Reserved
CP_SPI1_TXD_FLASH
O6
Reserved
CP_SPI1_CSN_FLASH
O8
Reserved
CP_SPI1_RXD_FLASH
N3
Reserved
CP_SPI1_CLK_FLASH
N5
Reserved
CP_SPI1_WPN_FLASH
Q36
FromAP_TCXO_REQ
Reserved
D21
SD_ENABLE
Reserved
V33
GPIO_CV2X_TX_RX
Reserved
[2020.03.10 v08]
1) p.8 RF support band update : [NA] n78 removed
[ECE] n79 removed
[CHN] WCDMA B5 add, TDD B34,B39 removed
[ROW] WCDMA B3, B5 add, 5G n3, n8 add
[Global] WCDMA B3 add, 5G n8 add
2) p.9 CA combination support band removed : 7A-20A-38A, 7A-28A-38A
3) p.12 Power voltage change : typical 4.0V -> 4.2V
Dimension H value change : 43 mm × 38 mm × 2.5 mm -> 34 mm × 38 mm × 3.4 mm
4) p.13 Block diagram update
5) p.14 Application Block Diagram eMMC update
6) p.16 Figure 2-1 LGA interface update
7) p.28 2.3 CP HW Revision update
8) p.31 Table 3-1 Definitions of the pins on the power supply interface USIM1 add
9) p.33 PCIe Interface Figure 3-5,3-6,3-7 update
10) p.37 4.2.2 Data Services and Power Class update
11) p.40 4.2.3 EN-DC upsupport band removed : DC_3A-41A_n78A, DC_1A-41A_n77A, DC_1A-41C_n77A,
DC_1A-41A_n78A, DC_1A-41C_n78A, DC_1A-41C_n79A,
DC_2A-5A_n66A, DC_2A-12A_n66A