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Hardware Guide
6.4 Label
Figure 6-4 Label
6.5 Storage Guidelines
The module must be properly stored and sealed in the vacuum package under temperatures below 40°C and
relative humidity below 90% to ensure weldability.
6.6 Moisture Sensitivity
Moisture Sensitivity Level 3
After unpacking, the module shall be assembled within 168 hours under environmental conditions
where the temperature is less than 30°C and the relative humidity is less than 60%. If the above
conditions cannot be met, the module shall be used after baking.
Baking is recommended for about 8 hours at 125
℃
.