Samsung Electronics
2-3
Specification
2-2 Quality
Conditions
Paper
Normal Paper
75g/m
2
Environment
Temperature : 20 ~ 25°C
Humidity : 40 ~ 60%
Print Quality
Image Density
Min. 1.3
Min. 1.0(Temperature : 10 ~ 15°C)
Background
Max. 0.2
Uniformity
Max. 0.2(Including Continuous Print)
Fusing
Min. 80% (All Black)
75g/m
2
Start Position
Top : x ± 4.23mm, Side : y ± 4mm
From Left
Skew
Top : Max. ± 1.5mm/117.9mm
Side : Max. ±1.8mm/241.3mm
Orthogonality
± 1.0mm
Horizontal Scan
± 0.6mm/208mm
(Bowed Line Skew : Pattern 1)
Special Paper Exception
Image Density : Min 1.0 (Envelope)
Fusing : Min. 70% (All Black)
(Envelope/OHP/Postcard)
Paper Jam
Less than 1/1,000(75g/m
2
Paper)
Paper Curl
First : Less than 10mm (10 Sheets, 75g/m
2
Paper)
After Cooling : Less than 10mm (10 Sheets, 75g/m
2
Paper)
Reliability
Insulation Resistance
Less than 10 M
Ω
(at DC 500V)
Dielectric Strength
AC 1000V (DC 1420V), 10mA
Ground Continuity
Less than 0.1
Ω
Voltage DIP
Rated Voltage ± 15%
AC Impulse Noise
AC 1000V 10, 100, 200, 400, 1000ns
Rated Power
Leakage Current
Less than 3.5mA
Surge
6 KV, 500A/3 KV, 500A
OZONE Emission
Less than 0.1 ppm (8 Hours)
Top Cover Open
Isolating the input power of the LSU,
High Voltage Part, and Fuser
Overcurrent Protect
Fuse inside the SMPS
Fusing System
Trouble Sensing
.The temperature doesn’t rise to the specific
temperature in the specific time.
.The temperature is too high.
Overheat Sensing
240 ~ 250°C (The thermostat cuts off the Fuser
from the power.)
Thermistor Open Sensing
.Without the initial temperature change of the Fuser
Indicate the
Fuser error
Summary of Contents for ML-4600/XET
Page 30: ...Disassembly and Reassembly 3 22 Samsung Electronics MEMO ...
Page 58: ...4 28 Samsung Electronics Troubleshooting Memo ...
Page 76: ...Exploded Views and Parts Lists 5 18 Samsung Electronics Memo ...
Page 86: ...PCB Diagrams Samsung Electronics 9 4 MEMO ...
Page 88: ...Memo Samsung Electronics 8 2 Connection diagram ...
Page 101: ...Schematic Diagrams 10 13 Samsung Electronics 10 4 Panel Circuit Diagram ...