Conclusion
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change without notice. Nonmetric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All
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2019-11
We validated the possibility of cracking tendencies through various tests. Various products, Environments, and characteristics of
tools can cause errors and affect test results.
However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage
and handling errors should be taken from the point of unpacking modules to inserting into the sockets on system boards.
Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive
components and the unit's diminishing size.
It’s difficult to predict and find out clear root causes of failures related with BOC PKG passive components due to many variances
and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-
related problems and make more effective process control possible.
