Hardware Installation and Reference Guide Preparation before Installation
For the RG-S6220-H series products, leave sufficient space in the front and at the back of the chassis (at least 20cm)
for ventilation. After various cables are connected, bundle the cables or place them in the cable management bracket to
avoid blocking air inlets. Dust the device every three months to avoid blocking the ventilation openings.
2.2.3 Temperature and Humidity Requirements
To ensure the normal operation and a prolonged service life of the RG-S6220-H, maintain an appropriate temperature
and humidity in the equipment room. The equipment room with too high or too low temperature and humidity for a long
period of time may damage the equipment.
In an environment with high relative humidity, the insulating material may have bad insulation or even leak
electricity. And sometimes the materials may suffer from mechanical performance change and metallic parts may
get rusted.
On the other hand, in an environment with low relative humidity, the insulating strip may dry and shrink, and static
electricity may occur easily and endanger the circuit on the device.
In an environment with high temperature, the equipment is subjected to even greater harm, as its performance
may degrade significantly and its service life may be shortened at high temperature for long that expedites the
aging process.
Temperature and humidity requirements of the RG-S6220-H:
Model
Working Temperature
Working Humidity
RG-S6220-48XS6QXS-H
0ºC to 50ºC / 32ºF to 122ºF
10% to 95%
RG-S6220-48XT6QXS-H
0ºC to 45ºC / 32ºF to 113ºF
10% to 95%
RG-S6220-32QXS-H
0ºC to 45ºC / 32ºF to 113ºF
10% to 95%
The ambient temperature and humidity are measured at the point that is 1.5 m above the floor and 0.4 m before
the device when there is no protective plate in front or at the back of the device rack.
2.2.4 Cleanness Requirements
Dust poses the top threat to the running of the device. The indoor dust falling on the device may be adhered by the
static electricity, causing poor contact of the metallic joint. Such electrostatic adherence may occur more easily when
the relative humidity is low, not only affecting the service life of the device, but also causing communication faults. The
following table shows the requirements for the dust content and granularity in the equipment room.
Substance
Concentration Limit (particles/m
3
)
Dust particles (diameter
≥
0.5
μ
m)
≤
3.5
×
10
6
Dust particles (diameter
≥
5
μ
m)
≤
3
×
10
4
Apart from dust, the salt, acid and sulfide in the air in the equipment room must also meet strict requirements; as such
poisonous substances may accelerate the corrosion of the metal and the aging of some parts. The equipment room
should be protected from the intrusion of harmful gases (for example, SO
2
, H
2
S, NO
2
and Cl
2
), whose requirements are
listed in the following table.
Gas
Average (mg/m
3
)
Maximum (mg/m
3
)
SO
2
0.3
1.0
H
2
S
0.1
0.5
