Rockwell Automation Publication 2071-UM001E-EN-P - November 2013
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Install the Kinetix 3 Drive System
Chapter 2
Electrical Noise Reduction
This section outlines best practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 3 system installations. For more
information on the concept of high-frequency (HF) bonding, the ground plane
principle, and electrical noise reduction, refer to the System Design for Control
of Electrical Noise Reference Manual, publication
Bonding Drives
Bonding is the practice of connecting metal chassis, assemblies, frames, shields,
and enclosures to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To achieve
a good bond between drive and the subpanel, surfaces need to be paint-free or
plated. Bonding metal surfaces creates a low-impedance return path for high-
frequency energy
Improper bonding of metal surfaces blocks the direct return path and lets high-
frequency energy travel elsewhere in the cabinet. Excessive high-frequency energy
can effect the operation of other microprocessor controlled equipment.
IMPORTANT
To improve the bond between the drive and subpanel, construct your subpanel
out of zinc plated (paint-free) steel.
Summary of Contents for Allen-Bradley Kinetix 3 2071-A10
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