User’s Manual
R20UT2989EJ0100 Rev. 1.00
Page 1 of 4
Sep. 05, 2014
RTE7701202CBG304T000J
Exchange Adapter for Connecting RH850/E1x Series
in 304-pin 0.8-mm-pitch BGA
1. Outline
The RTE7701202CBG304T000J is an exchange adapter (EA) for
connecting the RTE7701202EPA00000J emulator pod for the RH850/E1x
(subsequently referred to as the pod) to pad patterns for a 304-pin 0.8-mm-pitch
BGA (PRBG0304GB-A).
2. Package Components
Check to see if the RTE7701202CBG304T000J package has all the following
contents with reference to Contents of the Package included in the package after
purchasing this product.
(1)
RTE7701202CBG304T000J exchange adapter
1 pc.
(2)
Table of Toxic and Hazardous Substance and Elements 1 sh.
3. Specifications
Table 1 Specifications
Applicable package
PRBG0304GB-A
(304-pin 0.8-mm-pitch BGA)
Insertion/removal
iterations of connector
100 times guaranteed
4. Usage (See Figure 2)
The RTE7701202CBG304T000J can be used for debugging and on-board
evaluation in common by mounting the TC on the target system.
(1) For debugging
Mount the TC on the pad pattern for the MCU on the target
system board. In addition, connect the RTE7701202CBG304T000J to the pod,
and then attach the RTE7701202CBG304T000J above the TC.
The height of the socket is adjustable by inserting the SA1 or SA2 between
the TC and RTE7701202CBG304T000J if this is desired.
(2) For on-board evaluation
The TC on the user system is used to attach the MA after it has been fitted
with an MCU that has flash ROM or a one-time PROM.
Before using the RTE7701202CBG304T000J, be sure to read the precautions
on page 3.
* BSSOCKET, CSSOCKET, and LSPACK are the trademarks of Tokyo Eletech Corporation.
R20UT2989EJ0100
Rev. 1.00
Sep. 05, 2014
Figure 1 External View of the RTE7701202CBG304T000J
Figure 2 Usage of the RTE7701202CBG304T000J
SA1: Space adapter (sold separately, product of Tokyo Eletech
Corporation)
Model Name:
CSSOCKET304A2219RE03
SA2: Space adapter (sold separately, product of Tokyo Eletech
Corporation)
Model Name:
CSSOCKET304A2219RE04
TC: Target connector (sold separately, product of Tokyo Eletech
Corporation)
Model name:
BSSOCKET304A2219RE21N
MA: Mounting adapter (sold separately, product of Tokyo Eletech
Corporation)
Model name:
LSPACK304A2219RE01
RTE7701202CBG304T000J exchange adapter
●
In the figure indicates an example of the location of the pin that governs
alignment. Be sure to align the pin one positions of the pad pattern on the board
and other parts.
Flash memory MCU and etc.
(MA: Inserted into the
LSPACK)
TC: BSSOCKET
(2) For on-board evaluation
(1) For debugging
R
ENESAS
RTE
7701202
EPAxR
SA1:CSSOCKETxxRE03
or
SA2:CSSOCKETxxRE04
MA: LSPACK
RTE7701202CBG304T000J
Pod for RTE7701202EPA00000J (sold separately)
304-pin 0.8-mm-pitch
(PRBG0304GB-A) pad patterns