Q150T Sample Preparation System
10473 - Issue 5
78
Q150T - Instruction Manual
9
Appendices
9.1
Profile Parameters
Operation of the Q150T is controlled by a process profile. There are several types of
profile as listed in Table 24. Each profile contains a number of adjustable parameters.
The following tables list the parameters available in each type of profile, showing their
default values and allowed ranges.
Table 24
FTM/Timed Sputter Coating parameters
Name
Default
Value
Minimum
Value
Maximum
Value
Comment
Material
Gold
Target Material required for this
process
Sputter Current
(mA)
20
1
50
Coating current
Updated from material list
Sputter Time
(seconds)
120
1
3600
Timed Sputter only
Stops sputtering at set time.
Terminate
Thickness (nm)
1
2000
FTM Terminated Sputter only
Stops sputtering when the FTM
reads this thickness
Maximum Sputter
Time (minutes)
4.0
0
60.0
FTM Terminated Sputter only
Sets upper limit to sputtering if
FTM thickness has not been
achieved
Tooling Factor
2.3
0.1
10
Tooling factor for this process
This is multiplied by that in the
material list.
Clean target*
No
No
Yes
Clean target before coating
Flush chamber*
No
No
Yes
Flush chamber with nitrogen
before pumping down.
* Admin group level required to edit this property
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