Q150T Sample Preparation System
10473 - Issue 5
28
Q150T - Instruction Manual
5
Application Guidelines
This section describes the QT processes and their typical applications.
5.1
QT Timed Sputter
Suitable for the following applications:
SEM coatings for tungsten emission SEM.
High resolution SEM coatings for field emission SEM.
General thin film coatings.
Target materials: Au, Au/Pd or Pt
5.1.1
Tungsten SEM work
For this type of work, the aim is to achieve a typical thickness of 10-20nm from a gold
target. Figure 9-1 shows the deposition graph for gold. With a current of 20mA, a
deposition rate of 20nm/minute is typically achieved (assuming that the sample height is
set to the default height of 60mm and the vacuum is 1x10
-2
mBar).
To achieve a gold coating of 10nm create a new profile based on
QT Timed Sputter
: The
default
Material setting
is
Au
.
Edit the current to 25 mA.
Set the time to 30 seconds.
If necessary adjust the time or current slightly to modify the thickness.
5.1.2
High resolution SEM coatings for field emission SEM
Generally, the recommended target materials are Cr or Ir and the objective is to
generate a coating thickness of 5-10 nm.
The deposition graph using a Cr target is shown in Figure 9-2. With a current of 100mA,
a deposition rate of 20nm/minute is typically achieved (assuming that the sample height
is set to the default height of 60mm and the vacuum is 1x10
-2
mBar)
To achieve a Cr coating of 10nm, create a new profile based on
QT Timed Sputter
:
Set the material to Cr.
Edit the current to 100 mA.
Set the time to 30 seconds.
If necessary adjust the time or current slightly to modify the thickness.
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