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Smart Module Series

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To ensure better performance and avoid damage to (U)SIM cards, please follow the criteria below in

(U)SIM circuit design:

⚫

Place the (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM

card signals as less than 200 mm as possible.

⚫

Keep (U)SIM card signals away from RF and VBAT traces.

⚫

Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1

μF.

Additionally, place the capacitor near the

(U)SIM

card connector.

⚫

To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and

shield them with ground. USIM_RST also needs ground protection.

⚫

In order to ensure good ESD protection, it is recommended to add a TVS diode array with parasitic

capacitance not exceeding 50 pF

. Add 22 Ω resistors in series between the module and (U)SIM card

to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM

peripheral circuit should be close to the (U)SIM card connector.

⚫

Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF

interference, and place them as close to the

(U)SIM

card connector as possible.

3.11. SD Card Interface

The module supports SD 3.0 specifications. The pin definition of the SD card interface is shown below.

Table 15: Pin Definition of SD Card Interface

Pin Name

Pin No.

I/O

Pin Description

Comment

SD_CLK

SD card clock

Ω characteristic impedance.

SD_CMD

DIO

SD card command

SD_DATA0

DIO

SDIO data bits

SD_DATA1

DIO

SD_DATA2

DIO

SD_DATA3

DIO

SD_DET

SD card hot-plug detect

Active low.

SD_VDD

SD card power supply

If a large-capacity T-Flash card is to

be connected, it is recommended to

add an LDO which can supply 1 A

current.

Summary of Contents for SC200L

Page 1: ...SC200L Series Dual band Wi Fi Hardware Design Smart Module Series Version 1 0 Date 2021 09 17 Status Released ...

Page 2: ...n though we employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis We may revise or restate this document from time to time at our sole discretion without any prior notice to you Use and Disclosure Restrictions License Agreements Documents and info...

Page 3: ...market sell offer for sale or otherwise maintain production of any our products or any other hardware software device tool information or product We moreover disclaim any and all warranties arising from the course of dealing or usage of trade Disclaimer a We acknowledge no liability for any injury or damage arising from the reliance upon the information b We shall bear no liability resulting from ...

Page 4: ...y cause interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions such as when the mobile bill is unpaid or the U SIM card is invalid When emergency help ...

Page 5: ...eries Dual band Wi Fi _Hardware_Design 4 111 About the Document Revision History Version Date Author Description 2021 05 26 Shihao HUANG Shawn HU Creation of the document 1 0 2021 09 17 Shihao HUANG Shawn HU First official release ...

Page 6: ... 3 4 2 Voltage Stability Requirements 33 3 4 3 Reference Design for Power Supply 34 3 5 Turn On and Off the Module 35 3 5 1 Turn On the Module with PWRKEY 35 3 5 2 Turn Off Restart the Module 37 3 6 Power Output 37 3 7 Battery Charging and Management 38 3 8 USB Interfaces 39 3 9 UART Interfaces 43 3 10 U SIM Interfaces 44 3 11 SD Card Interface 46 3 12 GPIO Interfaces 48 3 13 I2C Interfaces 50 3 1...

Page 7: ...gn for Main and Rx diversity Antenna Interfaces 72 6 2 Wi Fi Bluetooth Antenna Interface 73 6 3 GNSS Antenna Interface 74 6 3 1 Reference Circuit Design for Passive Antenna 75 6 3 2 Reference Circuit Design for Active Antenna 75 6 5 Reference Design of RF Layout 76 6 6 Antenna Installation 78 6 6 1 Antenna Requirements 78 6 6 2 Recommended RF Connector for Antenna Installation 79 7 Reliability Rad...

Page 8: ...Smart Module Series SC200L_Series Dual band Wi Fi _Hardware_Design 7 111 9 3 1 Carrier Tape 103 9 3 2 Plastic Reel 104 9 3 3 Packaging Process 104 10 Appendix References 106 ...

Page 9: ...on of SPI Interface 50 Table 20 Pin Definition of ADC Interface 51 Table 21 Pin Definition of LCM Interface 51 Table 22 Pin Definition of Touch Panel Interface 53 Table 23 Pin Definition of Camera Interfaces 55 Table 24 MIPI Trace Length Inside the Module 57 Table 25 Pin Definition of Sensor Interfaces 58 Table 26 Pin Definition of Audio Interfaces 59 Table 27 Wi Fi Transmitting Performance 64 Tab...

Page 10: ...ower 90 Table 48 SC200L EU RF Output Power 91 Table 49 SC200L AU RF Output Power 92 Table 50 SC200L CE RF Receiving Sensitivity 93 Table 51 SC200L EU RF Receiving Sensitivity 94 Table 52 SC200L AU RF Receiving Sensitivity 94 Table 53 ESD Characteristics Temperature 25 C Humidity 45 95 Table 54 Recommended Thermal Profile Parameters 102 Table 55 Carrier Tape Dimension Table Unit mm 103 Table 56 Pla...

Page 11: ... Design of LCM External Backlight Driving Circuit 53 Figure 22 Reference Circuit Design for Touch Panel Interface 54 Figure 23 Reference Circuit Design for Two Camera Applications 56 Figure 24 Reference Design for ECM Microphone 60 Figure 25 Reference Design for MEMS Microphone 60 Figure 26 Reference Circuit Design for Earpiece Interface 61 Figure 27 Reference Circuit Design for Headset Interface ...

Page 12: ... Bottom Dimensions Bottom View 97 Figure 43 Recommended Footprint Top View 98 Figure 44 Top and Bottom Views 99 Figure 45 Recommended Reflow Soldering Thermal Profile 101 Figure 46 Carrier Tape Dimension Drawing 103 Figure 47 Plastic Reel Dimension Drawing 104 Figure 48 Packaging Process 105 ...

Page 13: ...the module With the application notes and user guides provided separately you can easily use the module to design and set up mobile applications 1 1 Special Mark Table 1 Special Mark Mark Definition Unless otherwise specified when an asterisk is used after a function feature interface pin name AT command or argument it indicates that the function feature interface pin AT command or argument is und...

Page 14: ...LONASS BeiDou satellite positioning systems Supports multiple audio and video codecs Built in high performance Mail T820 graphics processing unit Provides multiple audio and video input output interfaces as well as abundant GPIO interfaces SC200L series Dual band Wi Fi is available in three variants SC200L CE SC200L EU and SC200L AU The module supports multiple standards and multiple frequency ban...

Page 15: ... B38 B40 B41 200 MHz WCDMA B1 B5 B8 GSM 900 1800 MHz Wi Fi 802 11a b g n ac 2402 2482 MHz 5180 5825 MHz Bluetooth 5 0 2402 2480 MHz GNSS GPS 1575 42 1 023 MHz GLONASS 1597 5 1605 8 MHz BeiDou 1561 098 2 046 MHz Mode Frequency bands LTE FDD B1 B2 B3 B4 B5 B7 B8 B28 LTE TDD B38 WCDMA B1 B2 B4 B5 B8 GSM 850 900 1800 1900 MHz Wi Fi 802 11a b g n ac 2402 2482 MHz 5180 5825 MHz Bluetooth 5 0 2402 2480 M...

Page 16: ...eMMC 2 GB LPDDR3 optional System Android 10 0 Power VBAT power supply rang 3 50 4 20 V Typical supply voltage 3 80 V Transmitting Power Class 4 33 dBm 2 dB for GSM850 Class 4 33 dBm 2 dB for EGSM900 Class 1 30 dBm 2 dB for DCS1800 Class 1 30 dBm 2 dB for PCS1900 Class E2 27 dBm 3 dB for GSM850 8 PSK Class E2 27 dBm 3 dB for EGSM900 8 PSK Class E2 26 dBm 3 dB for DCS1800 8 PSK Class E2 26 dBm 3 dB ...

Page 17: ...s lane Supports up to HD 1440 720 60 fps Camera Interfaces Supports 2 groups of MIPI_CSI up to 1 5 Gbps lane Front camera 1 lane MIPI which can support up to 2 MP camera Rear camera 2 lane MIPI which can support up to 8 MP camera Video codec Video codec encoding decoding 1080P 30 fps 1080P 30 fps Wi Fi video encoding up to 720P 30 fps decoding up to 1080P 30 fps Audio Interfaces Audio input 3 anal...

Page 18: ...ports SD card hot plug U SIM Interfaces 2 U SIM interfaces Supports USIM SIM card 1 80 V or 2 95 V Supports Dual Card Dual Standby by default I2C Interfaces 4 I2C interfaces Used for peripherals such as touch screen camera sensor etc SPI Interface 1 SPI interface multiplexed from GPIO interfaces Used for fingerprint recognition or other peripherals ADC Interface 1 general purpose ADC interface Sup...

Page 19: ...Connectivity Air Interface Processors Codec Power Signal Power Function RF Frontend GNSS Frontend ANT_DRX ANT_ MAIN 26M TSX PMU ADC Headset PWRKEY VOL_UP VOL_DOWN SD_VDD USIM1_VDD USIM2_VDD LDO1_1V85 LDO2_1V8 LDO3_2V8 LDO4_2V8 VBAT_BB VBAT_RF WCN WIFI BT Frontend 32K 26M USB 2 0 Hub Figure 1 Functional Diagram 2 4 EVB To help you design and test applications with the module Quectel supplies an eva...

Page 20: ...wing chapters provide the detailed description of pins interfaces listed below Power supply USB interfaces UART interfaces U SIM interfaces SD card interface GPIO interfaces I2C interfaces SPI interface ADC interface LCM interface Touch panel interface Camera interfaces Sensor interfaces Audio interfaces Emergency download interface ...

Page 21: ...GND 52 DSI_CLK_N 53 DSI_CLK_P 54 DSI_LN0_N 55 DSI_LN0_P 56 DSI_LN1_N 57 DSI_LN1_P 58 DSI_LN2_N 59 DSI_LN2_P 60 DSI_LN3_N 61 DSI_LN3_P 62 GND 63 CSI1_CLK_N 64 CSI1_CLK_P 65 CSI1_LN0_N 66 CSI1_LN0_P 67 CSI1_LN1_N 68 CSI1_LN1_P 69 GND 70 CSI0_CLK_N 71 CSI0_CLK_P 72 CSI0_LN0_N 73 CSI0_LN0_P 186 RESERVED 185 BAT_ID 184 CS_P 183 CS_M 182 RESERVED 181 RESERVED 180 RESERVED 179 RESERVED 178 RESERVED 177 R...

Page 22: ...scription DC Characteristics Comment VBAT_BB 1 2 PIO Power supply for module s baseband part Vmax 4 20 V Vmin 3 50 V Vnom 3 80 V Provide them with sufficient current of at least 3 A It is suggested to add a TVS diode for surge protection VBAT_RF 145 146 PI Power supply for module s RF part Vmax 4 20 V Vmin 3 50 V Vnom 3 80 V LDO1_1V85 111 PO 1 85 V output power supply Vnom 1 85 V IOmax 100 mA Powe...

Page 23: ...f not used keep it open GND Pin Name Pin No GND 3 7 12 15 27 51 62 69 76 78 85 86 88 89 120 122 130 132 135 140 143 144 162 171 172 176 187 188 189 190 191 202 203 204 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 226 227 228 229 230 231 233 234 235 236 237 238 240 241 243 244 245 247 248 250 251 255 256 258 259 261 266 268 269 271 272 273 274 Audio Interfaces Pin Nam...

Page 24: ...50 V MIC3_P 152 AI Microphone input for channel 2 MIC3_N 151 AI Microphone input for channel 2 MIC_BIAS2 149 PO Microphone bias voltage 2 Vmin 2 20 V Vmax 3 00 V Vnom 2 80 V USB1 Interface Pin Name Pin No I O Description DC Characteristics Comment USB_VBUS 141 142 PI Charging power input USB 5 V power input USB adaptor insertion detect Vmax 9 20 V Vmin 4 50 V Vnom 5 00 V USB_DM 13 AIO USB differen...

Page 25: ...led by default Active low If it is not used keep it open USIM2_RST 18 DO U SIM2 card reset VOLmax 0 1 USIM2_VDD VOHmin 0 9 USIM2_VDD USIM2_CLK 19 DO U SIM2 card clock VOLmax 0 1 USIM2_VDD VOHmin 0 9 USIM2_VDD USIM2_DATA 20 DIO U SIM2 card data VILmax 0 3 USIM2_VDD VIHmin 0 7 USIM2_VDD VOLmax 0 1 USIM2_VDD VOHmin 0 9 USIM2_VDD USIM2_VDD 21 PO U SIM2 card power supply 1 80 V U SIM Vmax 1 85 V Vmin 1...

Page 26: ...max 3 1 V Vmin 2 90 V Either 1 8 V or 2 95 V U SIM card is supported UART Interfaces Pin Name Pin No I O Description DC Characteristics Comment UART0_TXD 34 DO UART0 transmit VOLmax 0 20 V VOHmin 1 46 V 1 85 V power domain If not used keep these pins open UART0_RXD 35 DI UART0 receive VILmax 0 48 V VIHmin 1 39 V UART0_CTS 36 DI DCE clear to send VILmax 0 48 V VIHmin 1 39 V UART0_RTS 37 DO DCE requ...

Page 27: ...IHmin 2 17 V VOLmax 0 31 V VOHmin 2 61 V SD_DATA0 41 DIO SDIO data bits SD_DATA1 42 DIO SD_DATA2 43 DIO SD_DATA3 44 DIO SD_DET 45 DI SD card hot plug detect VILmax 0 48 V VIHmin 1 39 V Active low Touch Panel TP Interface Pin Name Pin No I O Description DC Characteristics Comment TP_INT 30 DI TP interrupt VILmax 0 48 V VIHmin 1 39 V 1 85 V power domain TP_RST 31 DO TP reset VOLmax 0 20 V VOHmin 1 4...

Page 28: ...0 DSI_LN1_N 56 AO MIPI DSI data 1 DSI_LN1_P 57 AO MIPI DSI data 1 DSI_LN2_N 58 AO MIPI DSI data 2 DSI_LN2_P 59 AO MIPI DSI data 2 DSI_LN3_N 60 AO MIPI DSI data 3 DSI_LN3_P 61 AO MIPI DSI data 3 Camera Interfaces Pin Name Pin No I O Description DC Characteristics Comment CSI1_CLK_N 63 AI MIPI clock of rear camera CSI1_CLK_P 64 AI MIPI clock of rear camera CSI1_LN0_N 65 AI MIPI lane 0 data of rear c...

Page 29: ...DO Power down of rear camera VOLmax 0 20 V VOHmin 1 46 V SCAM_RST 81 DO Reset of front camera VOLmax 0 20 V VOHmin 1 46 V SCAM_PWDN 82 DO Power down of front camera VOLmax 0 20 V VOHmin 1 46 V CAM_I2C_SCL 83 OD I2C clock of camera CAM_I2C_SDA 84 OD I2C data of camera Keypad Interfaces Pin Name Pin No I O Description DC Characteristics Comment PWRKEY 114 DI Turn on off the module VILmax 0 60 V VIHm...

Page 30: ...e pole of LED The maximum current is 27 7 mA SENSOR_I2C Interface Pin Name Pin No I O Description DC Characteristics Comment SENSOR_I2C_ SCL 91 OD I2C clock for external sensor 1 85 V power domain Can be used for other I2C devices SENSOR_I2C_ SDA 92 OD I2C data for external sensor I2C4 Interface Pin Name Pin No I O Description DC Characteristics Comment I2C4_SDA 106 OD I2C4 data 1 85 V power domai...

Page 31: ...ND with a 10 kΩ resistor BAT_ID 185 AI Battery type detect Input voltage 0 1 2 V If not used keep it open Antenna Interfaces Pin Name Pin No I O Description DC Characteristics Comment ANT_MAIN 87 AIO Main antenna interface 50 Ω impedance ANT_DRX 131 AI Rx diversity antenna interface ANT_GNSS 121 AI GNSS antenna interface ANT_WIFI BT 77 AIO Wi Fi Bluetooth antenna interface GPIO Interfaces Pin Name...

Page 32: ...purpose input output Can be multiplexed into PWMC GPIO_54 109 DIO General purpose input output GPIO_55 110 DIO General purpose input output GPIO_122 112 DIO General purpose input output Can be multiplexed into EXTINT12 GPIO_30 113 DIO General purpose input output GPIO_29 115 DIO General purpose input output GPIO_93 116 DIO General purpose input output Can be multiplexed into EXTINT8 GPIO_90 117 DI...

Page 33: ..._5 262 DO Generic RF control Other Pins Pin Name Pin No I O Description DC Characteristics Comment USB_BOOT 46 DI Force the module into emergency download mode VILmax 0 48 V VIHmin 1 39 V You can force the module to enter emergency download mode by pulling it down to ground during power up VIB_DRV_P 28 PO Motor drive VO 1 80 3 30 V IOmax 100 mA Connect it to the positive pole of the motor Reserved...

Page 34: ...not drop below 3 25 V use a bypass capacitor of about 100 μF with low ESR ESR 0 7 Ω and reserve a multi layer ceramic chip capacitor MLCC array due to its ultra low ESR It is recommended to use three ceramic capacitors 100 nF 33 pF 10 pF to compose the MLCC array and place these capacitors close to VBAT_BB VBAT_RF pins Additionally add a 4 7 μF capacitor in parallel The main power supply from an e...

Page 35: ... The power supply of the module should be able to provide sufficient current of at least 3 A If the voltage difference between the input and output is not too big it is suggested to use an LDO to supply power for the module If there is a big voltage difference between the input source and the desired output VBAT a buck converter is recommended The following figure shows a reference design for 5 V ...

Page 36: ...and Off the Module 3 5 1 Turn On the Module with PWRKEY You can turn on the module by driving the PWRKEY pin low for at least 2 5 s PWRKEY pin is pulled up to VBAT internally It is recommended to use an open drain collector driver to control the PWRKEY pin A simple reference circuit is illustrated in the following figure Turn on pulse PWRKEY 4 7K 47K 2 5s R1 R2 Q1 R3 1K Figure 6 Turn On the Module...

Page 37: ...O2_1V8 LDO3_2V8 Software Controlled 1 s Others 55 s Figure 8 Power Up Timing 1 When the module is powered on for the first time its timing of power up may be different from that shown above 2 Make sure that VBAT is stable before pulling down PWRKEY It is recommended to wait until VBAT to be stable at 3 8 V for at least 30 ms before pulling down PWRKEY Additionally PWRKEY cannot be kept pulled down...

Page 38: ... The restart timing is as follows VBAT PWRKEY Others 7 s Hardware Reset Figure 9 Restart Timing 3 6 Power Output The module supports output of regulated voltages for peripheral circuits During application it is recommended to connect a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high frequency noise Table 8 Power Description Pin Name Default Voltage V Driving Current mA Idle...

Page 39: ...tch to CV mode and the charging current will decrease gradually When the battery level reaches 100 the charging is completed Table 9 Pin Definition of Charging Interface The module supports battery temperature detection in the condition that the battery integrates a thermistor 10 kΩ 1 NTC thermistor with a B constant of 3380 K by default and the thermistor should be connected to the BAT_THERM pin ...

Page 40: ...via a 10 kΩ resistor Otherwise the system may misjudge that the battery temperature is abnormal and therefore causes battery charging failure BAT_SNS must be connected Otherwise the module will have trouble in voltage detection as well as associated module power on off issues and battery charging discharging issues The module supports current sensing fuel gauge by default and conducts current samp...

Page 41: ...the module enter host mode USB_DP USB_DM USB_VBUS 1 2 3 4 5 USB_DP USB_DM USB_VBUS USB_ID GND GND GND GND GND 6 7 8 9 100 nF Module C1 D1 D2 D3 ESD ESD ESD USB_ID D4 ESD GND Figure 11 Reference Design for USB1 Interface Pin Name Pin No I O Description Comment USB_VBUS 141 142 PI Charging power input USB 5 V power input USB adaptor insertion detect Vmax 9 20 V Vmin 4 50 V Vnom 5 00 V USB_DM 13 AIO ...

Page 42: ...igure 12 Reference Design for USB1 Power Supply The following table shows the pin definition of USB2 Table 11 Pin Definition of USB2 Interface HUB_USB_DP USB_VBUS2 1 2 3 4 5 HUB_USB_DP HUB_USB_DM USB_ID GND GND GND GND GND 6 7 8 9 100 nF Module C1 D1 D2 D3 ESD ESD ESD GND HUB_USB_DM USB_VBUS2 Figure 13 Reference Design for USB2 Interface Pin Name Pin No I O Description Comment HUB_USB_DP 173 AIO U...

Page 43: ...pairs with total grounding The impedance of USB differential traces is 90 Ω Keep the ESD protection devices as close as possible to the USB connector Pay attention to the influence of junction capacitance of ESD protection devices on USB data traces Typically the capacitance value should be less than 2 pF Do not route signal traces under crystals oscillators magnetic devices or RF signal traces Ro...

Page 44: ... 85 V power domain A level translator should be used if your application is equipped with a 3 3 V UART interface VCCA VCCB OE A1 A2 A3 A4 GND B1 B2 B3 B4 LDO1_1V85 UART 0_RTS UART0_RXD UART0_CTS UART0_TXD RXD_3 3 V CTS_3 3 V TXD_3 3 V VDD_3 3 V TXS0104EPWR C1 100 pF C2 U1 100 pF RTS_3 3 V Figure 15 Reference Circuit with Level Translator Chip for UART0 Pin Name Pin No I O Description Comment UART0...

Page 45: ... RS 232 Level Match Circuit for UART0 3 10 U SIM Interfaces The module provides two U SIM interfaces that meet ETSI and IMT 2000 requirements Dual SIM Card Dual Standby is supported by default Either 1 8 V or 2 95 V U SIM card is supported and the U SIM card interfaces are powered by the internal power supply of the module Table 14 Pin Definition of U SIM Interfaces Pin Name Pin No I O Description...

Page 46: ... R4 GND Figure 17 Reference Circuit for U SIM Interface with an 8 pin U SIM Card Connector If USIM_DET is not used keep it open The following is a reference circuit for U SIM interface with a 6 pin U SIM card connector Module USIM_VDD USIM_RST USIM_CLK USIM_ DATA 22R 22R 22R 1 μF ESD 22pF VCC RST CLK IO VPP GND 22 pF 22 pF C1 D1 R2 R3 R4 C2 C3 C4 USIM_DET USIM Card Connector NM 10K R1 GND Figure 1...

Page 47: ...acitance not exceeding 50 pF Add 22 Ω resistors in series between the module and U SIM card to suppress EMI spurious transmission and enhance ESD protection Please note that the U SIM peripheral circuit should be close to the U SIM card connector Add 22 pF capacitors in parallel on USIM_DATA USIM_CLK and USIM_RST signal lines to filter RF interference and place them as close to the U SIM card conn...

Page 48: ... 0 5 mm or above To ensure the stability of output power add a 4 7 μF and a 33 pF capacitor in parallel near the SD card connector SD_CMD SD_CLK SD_DATA0 SD_DATA1 SD_DATA2 and SD_DATA3 are all high speed signal traces In PCB design control the characteristic impedance of these traces to 50 Ω 10 and avoid crossing them with other traces It is recommended to route the traces on the inner layer of PC...

Page 49: ...pose input output GPIO_85 97 OUT Hiz DIO General purpose input output GPIO_88 98 IN PU DIO General purpose input output GPIO_49 99 IN PU DIO General purpose input output GPIO_48 100 IN PU DIO General purpose input output GPIO_156 101 IN PD DIO General purpose input output GPIO_22 102 IN PD DIO General purpose input output GPIO_23 103 IN PD DIO General purpose input output GPIO_28 104 IN PD DIO Gen...

Page 50: ...triggered by edge GPIO_55 110 IN PD DIO General purpose input output GPIO_122 112 IN PD DIO General purpose input output Can be multiplexed into EXTINT12 GPIO_30 113 IN PD DIO General purpose input output GPIO_29 115 IN PD DIO General purpose input output GPIO_93 116 IN PD DIO General purpose input output Can be multiplexed into EXTINT8 GPIO_90 117 IN PU DIO General purpose input output Can be mul...

Page 51: ...nition of SPI Interface Pin Name Pin No I O Description Comment TP_I2C_SCL 47 OD TP I2C clock Used for touch panel TP_I2C_SDA 48 OD TP I2C data CAM_I2C_SCL 83 OD I2C clock of camera Used for camera CAM_I2C_SDA 84 OD I2C data of camera I2C4_SCL 105 OD I2C4 clock Used for external devices I2C4_SDA 106 OD I2C4 data SENSOR_I2C_SCL 91 OD I2C clock for external sensor Used for external sensor SENSOR_I2C...

Page 52: ...ition of the LCM interface is shown below Table 21 Pin Definition of LCM Interface Pin Name Pin No I O Comment Pin Name ADC 128 AI General purpose ADC interface The maximum input voltage is 1 2 V Pin Name Pin No I O Description Comment LDO2_1V8 125 PO Provides enable signal for external LCD I O power supply LDO4_2V8 156 PO 2 80 V output power supply for LCD VCC Vnom 2 80 V IOmax 200 mA PWM 29 DO P...

Page 53: ...27 MIPI_TDP0 MIPI_TDN0 GND MIPI_TCP MIPI_TCN 29 28 30 3 4 5 6 3 4 5 6 3 4 5 6 3 4 5 6 DSI_LN1_N DSI_LN1_P DSI_LN0_N DSI_LN0_P 1 2 3 4 5 6 11 1 2 1 2 1 2 1 2 100nF 4 7 μF 1μF Module LCM FL1 FL2 FL3 FL4 FL5 EMI filter C3 C2 C1 NC GND GND GND GND GPIO_28 31 32 33 34 DSI LDO VBAT LDO2_1V8 EN OUTPUT C4 100nF GND Figure 20 Reference Circuit Design for LCM Interface MIPI are high speed signal lines It is...

Page 54: ...it design is shown in the following figure in which the PWM pin is used to adjust the backlight brightness LCM_LED Module 2 2 μF Backlight driver LCM_LED VBAT C1 PWM GND Figure 21 Reference Design of LCM External Backlight Driving Circuit 3 17 Touch Panel Interface The module provides one I2C interface for connection with Touch Panel TP and also provides the corresponding power supply and interrup...

Page 55: ...eps ON idle state is used for power supply for TP VDD by default and it can provide 200 mA current 3 18 Camera Interfaces Based on MIPI CSI standard the module supports 2 cameras 2 lane 1 lane 1 lane MIPI for front camera which supports up to 2 MP and 2 lane MIPI for rear camera which supports up to 8 MP The video and photo quality is determined by various factors such as the camera sensor camera ...

Page 56: ...SI1_LN0_P 66 AI MIPI lane 0 data of rear camera CSI1_LN1_N 67 AI MIPI lane 1 data of rear camera CSI1_LN1_P 68 AI MIPI lane 1 data of rear camera CSI0_CLK_N 70 AI MIPI clock of front camera CSI0_CLK_P 71 AI MIPI clock of front camera CSI0_LN0_N 72 AI MIPI lane 0 data of front camera CSI0_LN0_P 73 AI MIPI lane 0 data of front camera MCAM_MCLK 74 DO Master clock of rear camera 1 85 V power domain SC...

Page 57: ...MCLK LDO2_1V8 LDO3 _2V8 Front camera connector 4 7μF 1 μF MCAM_RST EMI EMI EMI EMI EMI LDO3 _2V8 AVDD AF_VDD DVDD DOVDD 1 μF CSI1_CLK_P CSI1_CLK_N CSI1_LN0_P CSI1_LN0_N CSI1_LN1_P CSI1_LN1_N CSI0 _CLK_P CSI0 _CLK_N CSI0 _LN0_P CSI0 _LN0_N 1 μF 4 7 μF 4 7 μF AVDD DOVDD OUT GND IN EN 1 2 V VBAT GPIO _ 32 1μF Figure 23 Reference Circuit Design for Dual Camera Applications CSI1 is used for rear camera...

Page 58: ...nded During impedance matching do not connect GND on different planes to ensure impedance consistency It is recommended to select a low capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF Route MIPI traces according to the following rules a The total trace length should not exceed 75 mm b Control the differential impedance within 100 Ω 10 c Control int...

Page 59: ...14 13 0 38 66 CSI1_LN0_P 13 75 67 CSI1_LN1_N 17 45 0 37 68 CSI1_LN1_P 17 08 70 CSI0_CLK_N 18 52 0 41 71 CSI0_CLK_P 18 93 72 CSI0_LN0_N 19 76 0 05 73 CSI0_LN0_P 19 81 Pin Name Pin No I O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor 1 85 V power domain Can be used for other I2C devices SENSOR_I2C_SDA 92 OD I2C data for external sensor GPIO_52 107 DI ALS PS sensor interrupt ...

Page 60: ...phone input for headset MIC_BIAS2 149 PO Microphone bias voltage 2 Vmin 2 20 V Vmax 3 00 V Vnom 2 80 V MIC3_P 152 AI Microphone input for channel 2 MIC3_N 151 AI Microphone input for channel 2 MIC_BIAS1 147 PO Microphone bias voltage 1 Vmin 2 20 V Vmax 3 00 V Vnom 2 50 V EAR_P 8 AO Earpiece output EAR_N 9 AO Earpiece output SPK_P 10 AO Speaker output SPK_N 11 AO Speaker output HPH_R 136 AO Headpho...

Page 61: ... D amplifier whose maximum output power is 0 8 W when the load is 8 Ω The headset interface features stereo left and right channel output and headset insertion detection function is supported 3 20 1 Reference Circuit Design for Microphone Interfaces MIC1_N NM ECM MIC C3 Module MIC1_P C1 MIC_BIAS1 1 2 F1 D2 MIC_P MIC_N 510R 2 2 μF NM C2 D1 1 5K 510R 1 5K R1 R2 R3 R4 F2 NM R5 GND Figure 24 Reference...

Page 62: ...rcuit Design for Earpiece Interface 3 20 3 Reference Circuit Design for Headset Interface ESD MIC2_P HPH_L HS_DET HPH_R HPH_REF 33 pF Module R1 3 6 4 5 2 1 33 pF C3 C4 C5 F3 F2 F1 D1 D2 D3 D4 R3 0R MIC_BIAS2 C6 4 7 μF C2 22 μF R5 33R R3 100K MIC2_N C7 1 μF 1 μF C9 C8 NM 1 2K C10 NM HPMIC_DET 10K R2 C1 22 μF R6 33R R6 0R D5 MIC R_AUDIO L_AUDIO GND DETECT 33 pF GND Figure 27 Reference Circuit Design...

Page 63: ...800 Please note that the resonant frequency point of a capacitor largely depends on the material and production technique Therefore you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high frequency noises The severity of the RF interference in the voice channel during GSM transmitting largely depends on the application design In some cases EGSM900 TDD ...

Page 64: ... by pulling it down to ground during power up This is an emergency option when start up failures or operational abnormalities occur For firmware upgrade and debugging in the future please reserve the following reference design S1 Module USB_BOOT R1 1K GND Figure 29 Reference Circuit Design for Emergency Download Interface The reference design above must be applied for firmware upgrade via USB inte...

Page 65: ...reless communication based on IEEE 802 11a b g n ac standard protocols The maximum data rate is 150 Mbps for 2 4 GHz frequency band and 433 Mbps for 5 GHz frequency band The features are as below Supports Wake on WLAN WoWLAN Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports STA mode Supports AP mode Supports Wi Fi Direct Supports MCS 0 7 for HT20 and HT40 Supports MCS 0 8 for VH...

Page 66: ... TBD 5 GHz 802 11a 6 Mbps TBD 802 11a 54 Mbps TBD 802 11n HT20 MCS0 TBD 802 11n HT20 MCS7 TBD 802 11n HT40 MCS0 TBD 802 11n HT40 MCS7 TBD 802 11ac VHT20 MCS0 TBD 802 11ac VHT20 MCS8 TBD 802 11ac VHT40 MCS0 TBD 802 11ac VHT40 MCS9 TBD 802 11ac VHT80 MCS0 TBD 802 11ac VHT80 MCS9 TBD Standard Rate Sensitivity 2 4 GHz 802 11b 1 Mbps TBD 802 11b 11 Mbps TBD 802 11g 6 Mbps TBD 802 11g 54 Mbps TBD 802 11...

Page 67: ...ded Synchronous Connection Oriented connection The BR EDR channel bandwidth is 1 MHz and can accommodate 79 channels The BLE channel bandwidth is 2 MHz and can accommodate 40 channels 802 11n HT20 MCS7 TBD 802 11n HT40 MCS0 TBD 802 11n HT40 MCS7 TBD 5 GHz 802 11a 6 Mbps TBD 802 11a 54 Mbps TBD 802 11n HT20 MCS0 TBD 802 11n HT20 MCS7 TBD 802 11n HT40 MCS0 TBD 802 11n HT40 MCS7 TBD 802 11ac VHT20 MC...

Page 68: ... PHY Cover Standard RF PHY TS 5 0 0 December 06 2016 4 2 1 Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of the module Table 30 Bluetooth Transmitting and Receiving Performance Version Data rate Maximum Application Throughput 1 2 1 Mbit s 80 kbit s 2 0 EDR 3 Mbit s 80 kbit s 4 2 24 Mbit s Reference 4 0 LE 5 0 48 Mbit s Reference 5 0 LE Transmi...

Page 69: ...d BeiDou With an embedded LNA the positioning accuracy of the module has been significantly improved 5 1 GNSS Performance The following table lists the GNSS performance of the module in conduction mode Table 31 GNSS Performance Parameter Description Typ Unit Sensitivity Cold start TBD dBm Reacquisition TBD dBm Tracking TBD dBm TTFF Cold start TBD s Warm start TBD s Hot start TBD s Static Drift CEP...

Page 70: ...l traces and RF components far away from high speed circuits switch mode power supplies power inductors the clock circuit of single chip microcomputers etc For applications with harsh electromagnetic environment or high ESD protection requirements it is recommended to add ESD protective diodes for the antenna interface The junction capacitance of the diodes should be less than 0 5 pF Otherwise it ...

Page 71: ...n Rx diversity antenna interfaces is shown below Table 32 Pin Definition of Main Rx diversity Antenna Interfaces 6 1 1 Module Operating Frequencies Table 33 SC200L CE Module Operating Frequencies Pin Name Pin No I O Description Comment ANT_MAIN 87 AIO Main antenna interface 50 Ω impedance ANT_DRX 131 AI Rx diversity antenna interface 3GPP Band Receive Transmit Unit EGSM900 925 960 880 915 MHz DCS1...

Page 72: ... 2675 2535 2675 MHz 3GPP Band Receive Transmit Unit EGSM900 925 960 880 915 MHz DCS1800 1805 1880 1710 1785 MHz WCDMA B1 2110 2170 1920 1980 MHz WCDMA B5 869 894 824 849 MHz WCDMA B8 925 960 880 915 MHz LTE FDD B1 2110 2170 1920 1980 MHz LTE FDD B3 1805 1880 1710 1785 MHz LTE FDD B5 869 894 824 849 MHz LTE FDD B7 2620 2690 2500 2570 MHz LTE FDD B8 925 960 880 915 MHz LTE FDD B20 791 821 832 862 MH...

Page 73: ...citors are not mounted by default and the resistors are 0 Ω 3GPP Band Receive Transmit Unit GSM850 869 894 824 849 MHz EGSM900 925 960 880 915 MHz DCS1800 1805 1880 1710 1785 MHz PCS1900 1930 1990 1850 1910 MHz WCDMA B1 2110 2170 1920 1980 MHz WCDMA B2 1930 1990 1850 1910 MHz WCDMA B4 2110 2155 1710 1755 MHz WCDMA B5 869 894 824 849 MHz WCDMA B8 925 960 880 915 MHz LTE FDD B1 2110 2170 1920 1980 M...

Page 74: ...t Design for Main and Rx diversity Antenna Interfaces 6 2 Wi Fi Bluetooth Antenna Interface Table 36 Pin Definition of Wi Fi Bluetooth Antenna Interface Pin Name Pin No I O Description Comment ANT_WIFI BT 77 AIO Wi Fi Bluetooth antenna interface 50 Ω impedance Table 37 Wi Fi Bluetooth Frequency Type Frequency Unit Wi Fi 2 4 GHz 2402 2482 MHz Wi Fi 5 GHz 5180 5825 MHz Bluetooth 2402 2480 MHz ...

Page 75: ...citors are not mounted by default and the resistor is 0 Ω ANT_WIFI BT R1 0R C1 Module NM C2 NM Figure 31 Reference Circuit Design for Wi Fi Bluetooth Antenna Interface 6 3 GNSS Antenna Interface Table 38 Pin Definition of GNSS Antenna Table 39 GNSS Frequencies Type Frequency Unit GPS 1575 42 1 023 MHz GLONASS 1597 5 1605 8 MHz BeiDou 1561 098 2 046 MHz Pin Name Pin No I O Description Comment ANT_G...

Page 76: ... dB it is recommended to add an external LNA circuit for better GNSS receiving performance and place the LNA close to the antenna 6 3 2 Reference Circuit Design for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna s signal path The common power supply voltage ranges from 3 3 V to 5 0 V Although featuring low power consumption the active antenna still requires st...

Page 77: ...W the materials dielectric constant the distance between signal layer and reference ground H and the clearance between RF trace and ground S Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures Figure 34 Microstrip Line Design on ...

Page 78: ...fully connect them to ground Keep the distance between the RF pins and the RF connector as short as possible Change all the right angle traces to curved ones and the recommended trace angle is 135 Reserve clearance under the signal pin of the antenna connector or solder joint Keep the reference ground of RF traces complete Meanwhile add some ground vias around RF traces and the reference ground to...

Page 79: ...ype Vertical Insertion Loss 1 dB GSM850 EGSM900 WCDMA B5 B8 LTE B5 B8 B20 B28A B28B Insertion Loss 1 5 dB DCS1800 PCS1900 WCDMA B1 B2 B4 LTE B1 B2 B3 B4 B34 B39 Insertion Loss 2 dB LTE FDD B7 LTE TDD B38 B40 B41 Wi Fi Bluetooth VSWR 2 Gain 1 dBi Max Input Power 50 W Input Impedance 50 Ω Polarization Type Vertical Insertion Loss 1 dB GNSS Frequency range 1559 1609 MHz Polarization RHCP or linear VS...

Page 80: ...stallation If RF connector is used for antenna connection it is recommended to use the U FL R SMT connector provided by Hirose Figure 38 Dimensions of the U FL R SMT Connector Unit mm U FL LP serial connectors listed in the following figure can be used to match the U FL R SMT Figure 39 Mechanicals of U FL LP Connectors ...

Page 81: ... SC200L_Series Dual band Wi Fi _Hardware_Design 80 111 The following figure describes the space factor of mated connector Figure 40 Space Factor of Mated Connector Unit mm For more details please visit http www hirose com ...

Page 82: ...n the following table Table 41 Absolute Maximum Ratings 7 2 Power Supply Ratings Table 42 Power Supply Ratings Parameter Min Max Unit VBAT 0 3 6 V USB_VBUS 0 3 16 0 V Current on VBAT 0 3 0 A Voltage on Digital Pins 0 3 1 98 V Parameter Description Conditions Min Typ Max Unit VBAT VBAT The actual input voltages must stay between the minimum and maximum values 3 50 3 80 4 20 V Voltage drop during tr...

Page 83: ...iant IVBAT Peak supply current during transmission slot Maximum power control level at EGSM900 1 80 3 0 A USB_VBUS 4 50 5 0 9 20 V Parameter Min Typ Max Unit Operating temperature range 3 30 25 75 º C Storage Temperature Range 40 90 º C Description Conditions Min Typ OFF state Power down TBD μA GSM GPRS supply current Sleep USB disconnected DRX 2 TBD mA Sleep USB disconnected DRX 5 TBD mA Sleep US...

Page 84: ...isconnected DRX 6 TBD mA Sleep USB disconnected DRX 7 TBD mA Sleep USB disconnected DRX 8 TBD mA GSM voice call EGSM900 PCL 5 TBD mA EGSM900 PCL 12 TBD mA EGSM900 PCL 19 TBD mA DCS1800 PCL 0 TBD mA DCS1800 PCL 7 TBD mA DCS1800 PCL 15 TBD mA WCDMA voice call B1 max power TBD mA B8 max power TBD mA GPRS data transfer EGSM900 1UL 4DL PCL 5 TBD mA EGSM900 2UL 3DL PCL 5 TBD mA EGSM900 3UL 2DL PCL 5 TBD...

Page 85: ...00 3UL 2DL PCL 2 TBD mA DCS1800 4UL 1DL PCL 2 TBD mA WCDMA data transfer B1 HSDPA max power TBD mA B8 HSDPA max power TBD mA B1 HSUPA max power TBD mA B8 HSUPA max power TBD mA LTE data transfer LTE FDD B1 max power TBD mA LTE FDD B3 max power TBD mA LTE FDD B5 max power TBD mA LTE FDD B8 max power TBD mA LTE TDD B34 max power TBD mA LTE TDD B38 max power TBD mA LTE TDD B39 max power TBD mA LTE TD...

Page 86: ...current Sleep USB disconnected DRX 5 TBD mA Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 7 TBD mA Sleep USB disconnected DRX 8 TBD mA LTE TDD supply current Sleep USB disconnected DRX 5 TBD mA Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 7 TBD mA Sleep USB disconnected DRX 8 TBD mA GSM voice call EGSM900 PCL 5 TBD mA EGSM900 PCL 12 TBD mA EGSM900 PCL 19 TBD mA D...

Page 87: ...8 TBD mA EGSM900 2UL 3DL PCL 8 TBD mA EGSM900 3UL 2DL PCL 8 TBD mA EGSM900 4UL 1DL PCL 8 TBD mA DCS1800 1UL 4DL PCL 2 TBD mA DCS1800 2UL 3DL PCL 2 TBD mA DCS1800 3UL 2DL PCL 2 TBD mA DCS1800 4UL 1DL PCL 2 TBD mA WCDMA data transfer B1 HSDPA max power TBD mA B5 HSDPA max power TBD mA B8 HSDPA max power TBD mA B1 HSUPA max power TBD mA B5 HSUPA max power TBD mA B8 HSUPA max power TBD mA LTE data tra...

Page 88: ...ected DRX 2 TBD mA Sleep USB disconnected DRX 5 TBD mA Sleep USB disconnected DRX 9 TBD mA WCDMA supply current Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 7 TBD mA Sleep USB disconnected DRX 8 TBD mA Sleep USB disconnected DRX 9 TBD mA LTE FDD supply current Sleep USB disconnected DRX 5 TBD mA Sleep USB disconnected DRX 6 TBD mA Sleep USB disconnected DRX 7 TBD mA Sleep USB dis...

Page 89: ...D mA DCS1800 PCL 15 TBD mA PCS1900 PCL 0 TBD mA PCS1900 PCL 7 TBD mA PCS1900 PCL 15 TBD mA WCDMA voice call B1 max power TBD mA B2 max power TBD mA B4 max power TBD mA B5 max power TBD mA B8 max power TBD mA GPRS data transfer GSM850 1UL 4DL PCL 5 TBD mA GSM850 2UL 3DL PCL 5 TBD mA GSM850 3UL 2DL PCL 5 TBD mA GSM850 4UL 1DL PCL 5 TBD mA EGSM900 1UL 4DL PCL 5 TBD mA EGSM900 2UL 3DL PCL 5 TBD mA EGS...

Page 90: ... transfer GSM850 1UL 4DL PCL 8 TBD mA GSM850 2UL 3DL PCL 8 TBD mA GSM850 3UL 2DL PCL 8 TBD mA GSM850 4UL 1DL PCL 8 TBD mA EGSM900 1UL 4DL PCL 8 TBD mA EGSM900 2UL 3DL PCL 8 TBD mA EGSM900 3UL 2DL PCL 8 TBD mA EGSM900 4UL 1DL PCL 8 TBD mA DCS1800 1UL 4DL PCL 2 TBD mA DCS1800 2UL 3DL PCL 2 TBD mA DCS1800 3UL 2DL PCL 2 TBD mA DCS1800 4UL 1DL PCL 2 TBD mA PCS1900 1UL 4DL PCL 2 TBD mA PCS1900 2UL 3DL P...

Page 91: ...SDPA max power TBD mA B1 HSUPA max power TBD mA B2 HSUPA max power TBD mA B4 HSUPA max power TBD mA B5 HSUPA max power TBD mA B8 HSUPA max power TBD mA LTE data transfer LTE FDD B1 max power TBD mA LTE FDD B2 max power TBD mA LTE FDD B3 max power TBD mA LTE FDD B4 max power TBD mA LTE FDD B5 max power TBD mA LTE FDD B7 max power TBD mA LTE FDD B8 max power TBD mA LTE FDD B28 A B max power TBD mA L...

Page 92: ...DD B1 TBD TBD LTE FDD B3 TBD TBD LTE FDD B5 TBD TBD LTE FDD B8 TBD TBD LTE FDD B34 TBD TBD LTE TDD B38 TBD TBD LTE TDD B39 TBD TBD LTE TDD B40 TBD TBD LTE TDD B41 TBD TBD Frequency Max Min EGSM900 TBD TBD DCS1800 TBD TBD WCDMA B1 TBD TBD WCDMA B5 TBD TBD WCDMA B8 TBD TBD LTE FDD B1 TBD TBD LTE FDD B3 TBD TBD LTE FDD B5 TBD TBD LTE FDD B7 TBD TBD LTE FDD B8 TBD TBD ...

Page 93: ...D TBD LTE TDD B40 TBD TBD LTE TDD B41 TBD TBD Frequency Max Min GSM850 TBD TBD EGSM900 TBD TBD DCS1800 TBD TBD PCS1900 TBD TBD WCDMA B1 TBD TBD WCDMA B2 TBD TBD WCDMA B4 TBD TBD WCDMA B5 TBD TBD WCDMA B8 TBD TBD LTE FDD B1 TBD TBD LTE FDD B2 TBD TBD LTE FDD B3 TBD TBD LTE FDD B4 TBD TBD LTE FDD B5 TBD TBD LTE FDD B7 TBD TBD LTE FDD B8 TBD TBD LTE FDD B28 A B TBD TBD ...

Page 94: ...ribed in Chapter 13 16 of 3GPP TS 51 010 1 Frequency Band Primary Diversity SIMO 3GPP SIMO EGSM900 TBD 102 4 dBm DCS1800 TBD 102 4 dBm WCDMA B1 TBD TBD TBD 106 7 dBm WCDMA B8 TBD TBD TBD 103 7 dBm LTE FDD B1 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B3 10 MHz TBD TBD TBD 93 3 dBm LTE FDD B5 10 MHz TBD TBD TBD 94 3 dBm LTE FDD B8 10 MHz TBD TBD TBD 93 3 dBm LTE TDD B34 10 MHz TBD TBD TBD 96 3 dBm LTE TDD...

Page 95: ...D B1 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B3 10 MHz TBD TBD TBD 93 3 dBm LTE FDD B5 10 MHz TBD TBD TBD 94 3 dBm LTE FDD B7 10 MHz TBD TBD TBD 94 3 dBm LTE FDD B8 10 MHz TBD TBD TBD 93 3 dBm LTE FDD B20 10 MHz TBD TBD TBD 93 3 dBm LTE FDD B28 10 MHz TBD TBD TBD 94 8 dBm LTE TDD B38 10 MHz TBD TBD TBD 96 3 dBm LTE TDD B40 10 MHz TBD TBD TBD 96 3 dBm LTE TDD B41 10 MHz TBD TBD TBD 94 3 dBm Frequency B...

Page 96: ...ectrostatic discharge characteristics of the module Table 53 ESD Characteristics Temperature 25 C Humidity 45 WCDMA B2 TBD TBD TBD 104 7 dBm WCDMA B4 TBD TBD TBD 106 7 dBm WCDMA B5 TBD TBD TBD 104 7 dBm WCDMA B8 TBD TBD TBD 103 7 dBm LTE FDD B1 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B2 10 MHz TBD TBD TBD 94 3 dBm LTE FDD B3 10 MHz TBD TBD TBD 93 3 dBm LTE FDD B4 10 MHz TBD TBD TBD 96 3 dBm LTE FDD B5...

Page 97: ...ical Information This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the dimension tolerances are 0 2 mm unless otherwise specified 8 1 Mechanical Dimensions Figure 41 Module Top and Side Dimensions Pin 1 Top view Side view ...

Page 98: ...art Module Series SC200L_Series Dual band Wi Fi _Hardware_Design 97 111 Figure 42 Module Bottom Dimensions Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE Pin 1 ...

Page 99: ...Recommended Footprint Figure 43 Recommended Footprint Top View 1 Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience 2 All RESERVED pins should be kept open and MUST NOT be connected to ground NOTE ...

Page 100: ...Hardware_Design 99 111 8 3 Top and Bottom Views Figure 44 Top and Bottom Views Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label please refer to the module received from Quectel NOTE ...

Page 101: ... is less than 10 e g a drying cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Condition Violation of the third requirement above occurs Vacuum sealed packaging is broken or the packaging has been removed for over 24 hours Before module repairing 5 If needed the pr...

Page 102: ...he paste fill the stencil openings and then penetrate to the PCB Apply proper force on the squeegee to produce a clean stencil surface on a single pass To guarantee module soldering quality the thickness of stencil for the module is recommended to be 0 18 0 20 mm For more details see document 5 The peak reflow temperature should be 235 246 º C with 246 º C as the absolute maximum reflow temperatur...

Page 103: ...or module cleaning since it can damage crystals inside the module 3 Due to the complexity of the SMT process please contact Quectel Technical Supports in advance for any situation that you are not sure about or any process e g selective soldering ultrasonic soldering that is not mentioned in document 5 Factor Recommendation Soak Zone Max slope 1 3 C s Soak time between A and B 150 C and 200 C 70 1...

Page 104: ...ging Specifications The module adopts carrier tape packaging and details are as follows 9 3 1 Carrier Tape Dimension details are as follows Figure 46 Carrier Tape Dimension Drawing Table 55 Carrier Tape Dimension Table Unit mm W P T A0 B0 K0 K1 F E 72 56 0 4 41 2 41 2 4 0 4 6 34 2 1 75 ...

Page 105: ...t mm 9 3 3 Packaging Process øD1 øD2 W 380 180 72 5 Place the module into the carrier tape and use the cover tape to cover them then wind the heat sealed carrier tape to the plastic reel and use the protective tape for protection One plastic reel can load 200 modules Place the packaged plastic reel humidity indicator card and desiccant bag into a vacuum bag then vacuumize it ...

Page 106: ...ries SC200L_Series Dual band Wi Fi _Hardware_Design 105 111 Figure 48 Packaging Process Place the vacuum packed plastic reel into a pizza box Put 4 pizza boxes into 1 carton and seal it One carton can pack 800 modules ...

Page 107: ... _Reference_Design 3 Quectel_SC200L_Series Dual band_Wi Fi _Pin_Description_and_GPIO_Configuration 4 Quectel_RF_Layout_Application_Note 5 Quectel_Module_Secondary_SMT_Application_Note Abbreviation Description ADC Analog to Digital Converter ALS Ambient Light Sensor AMR Adaptive Multi rate AP Access Point ARM Advanced RISC Machine BB Baseband BLE Bluetooth Low Energy bps Bits per Second BR Basic Ra...

Page 108: ...et Condenser Microphone EDGE Enhanced Data Rate for GSM Evolution EDR Enhanced Data Rate EFR Enhanced Full Rate EGSM Extended GSM eMMC Embedded Multimedia Card eSCO Extended Synchronous Connection Oriented ESD Electrostatic Discharge ESR Equivalent Series Resistance ETSI European Telecommunications Standards Institute EVB Evaluation Board FDD Frequency Division Duplex fps Frame per Second FR Full ...

Page 109: ...ions HD High Definition Plus HR Half Rate HS High Speed HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HT High Throughput IC Integrated Circuit IEEE Institute of Electrical and Electronics Engineers I O Input Output I2C Inter Integrated Circuit IMT 2000 International Mobile Telecommunications for the year 2000 IOmax Maximum Output Load Current IoT Internet of Things ...

Page 110: ...lation and Coding Scheme MEMS Micro Electro Mechanical System MIPI Mobile Industry Processor Interface MP Megapixel MSL Moisture Sensitivity Levels NTC Negative Temperature Coefficient OTA Over the Air Upgrade OTG On The Go OTP One Time Programable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication Service PDU Protocol Data Unit PHY...

Page 111: ...Request to Send SAW Surface Acoustic Wave SCO Synchronous Connection Oriented SD Secure Digital SIMO Single Input Multiple Output SMD Surface Mount Device SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface STA Station TDD Time Division Duplex TP Touch Panel TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver Transmitter U...

Page 112: ...ax Maximum Voltage Vnom Nominal Voltage Vmin Minimum Voltage VIHmin Minimum High level Input Voltage VILmax Maximum Low level Input Voltage VOHmin Minimum High level Output Voltage VOLmax Maximum Low level Output Voltage WAPI WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network ...

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