Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 15 / 111
The module is an SMD module with a total of 274 pins, including 146 LCC pins and 128 LGA pins. The
size is only 40.5 mm × 40.5 mm × 2.85 mm, which can be embedded in various M2M product applications
through pads. It is very suitable for the development of mobile devices such as POS machines, in-vehicle
computers, multimedia terminals, smart homes, and IoT terminals.
2.2. Key Features
Table 5: Key Features
Features
Details
CPU
Quad-core ARM Cortex-A53 CPU @ 1.4 GHz
32 KB L1 I-cache, 32 KB L1 D-cache, 256 KB L2 cache
GPU
Mali-T820 MP1 GPU, working at 680 MHz
Memory
⚫
8 GB eMMC + 1 GB LPDDR3 (default)
⚫
16 GB eMMC + 2 GB LPDDR3 (optional)
System
Android 10.0
Power
VBAT power supply rang: 3.50
–4.20 V
Typical supply voltage: 3.80 V
Transmitting Power
Class 4 (33 dBm ±2 dB) for GSM850
Class 4 (33 dBm ±2 dB) for EGSM900
Class 1 (30 dBm ±2 dB) for DCS1800
Class 1 (30 dBm ±2 dB) for PCS1900
Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
Class 3 (23 dBm ±2 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
Supports 3GPP Rel-10 Cat 4 FDD and TDD
Supports 1.4/3/5/10/15/20 MHz RF bandwidth
⚫
FDD: Max. 150 Mbps (DL)/ Max. 50 Mbps (UL)
⚫
TDD: Max. 130 Mbps (DL)/ Max. 30 Mbps (UL)
UMTS Features
Supports 3GPP Rel-9 HSDPA/HSUPA/WCDMA
Supports QPSK, 16QAM and 64QAM modulation
⚫
HSDPA: Max. 21 Mbps
⚫
HSUPA: Max. 11 Mbps
⚫
WCDMA: Max. 384 kbps (DL)/ Max. 384 kbps (UL)
