5G Module Series
RM505Q-AE Hardware Design
RM505Q-AE_Hardware_Design 72 / 79
6.9. Thermal Dissipation
RM505Q-AE is designed to work over an extended temperature range. To achieve a maximum
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate) for a long time, it is strongly recommended to add a thermal pad or other thermally
conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown below,.
Figure 38: Thermal Dissipation Area on Both Sides of Module (Unit: mm)
There are other measures to enhance heat dissipation performance:
⚫
Add as many ground vias as possible on PCB.
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Maximize airflow over/around the module.
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Place the module away from other heating sources.
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Module mounting holes must be used to attach (ground) the device to the main PCB ground.
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It is NOT recommended to apply solder mask on the main PCB where the m
odule’s thermal
dissipation area is located.
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To facilitate the thermal dissipation, select an appropriate material with thickness and surface for the
outer housing (i.e. the mechanical enclosure) of the application device that integrates the module.
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Use active cooling method when it is necessary to pull heat away from the module.
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If possible, add a heatsink on the top of the module. In this case, A thermal pad should be used
